Liquid absorbing core and supporting column integrated structure flat plate heat pipe based on carbon nano tube array

Abstract

The invention discloses a carbon nanotube array-based liquid-absorbing core support column integral structure flat heat pipe, including upper and lower metal cover plates and upper and lower metal cover plate liquid-absorbing cores formed on the inner sides of the upper and lower metal cover plates respectively The support column is an integrated structure; the upper and lower metal cover plates are sealed to form an airtight cavity by edge sealing, and the airtight cavity after vacuuming is filled with working liquid; the upper and lower metal cover plate liquid-absorbing core support column The integrated structure includes thin-layer carbon nanotubes grown on the inner surface of the metal cover plate and several vertical carbon nanotubes that continue to grow in specific regions of the thin-layer carbon nanotubes, which respectively constitute the capillary core of the flat heat pipe and the support column of the flat heat pipe ; The upper and lower metal cover support columns are staggered to form an integrated structure of liquid-absorbing core support columns in the form of fork rows. The invention has the characteristics of high thermal conductivity, small size, light weight, etc., can not only ensure the heat transfer performance of the flat heat pipe, but also achieve the mechanical strength and safety of the heat pipe during operation.

Description

technical field [0001] The invention relates to a flat heat pipe with an integrated structure of a liquid-absorbing core support column based on a carbon nanotube array, and belongs to the technical field of heat transfer. Background technique [0002] With the gradual development of electronic components in the direction of miniaturization, high power, and high performance, the development process will be accompanied by higher heat flux density, and the heat dissipation problem has gradually become a bottleneck restricting the development of highly integrated electronic components. Due to its high thermal conductivity and good temperature uniformity, the flat heat pipe can quickly transfer and diffuse the electric heat source with high heat flux density, which meets the requirements of electronic equipment for the compactness, reliability, and flexibility of the cooling device, and has gradually become a research solution to high Excellent choice for power device surface he...

AI Technical Summary

Problems solved by technology

[0003] The common flat heat pipe is composed of two metal cover plates. The inner surface of the cover plate is often covered with a capillary core structure such as wire mesh and sintered powder. The thermal conductivity of this capillary core structure is compared with that of the metal cover plate. It is one of the important components of the thermal resistance of the heat pipe, which greatly affects the heat transfer performance of the heat pipe

Moreover, for flat heat pipes, there are still problems such as large liquid flow resistance, large steam channel size, large volume, heavy weight, complicated manufacturing process, and poor sealing.

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