The invention discloses an adsorption type chip transfer device which comprises a base plate, a sliding plate, a driving assembly, a movable seat, a suction rod, a suction nozzle and an elastic piece. The sliding plate is arranged on the base plate in a sliding manner along the longitudinal direction, the driving assembly drives the sliding plate to move, and the movable seat is arranged on the sliding plate in a sliding manner along the longitudinal direction; the suction rod is installed on the movable seat and is connected with a vacuum generator, the suction nozzle is connected to the lower end of the suction rod, the elastic part is telescopically arranged between the sliding plate and the movable seat along the sliding direction of the movable seat, and the movable seat abuts against the upper end of the elastic part, so that the movable seat is suspended on the sliding plate. According to the adsorption type chip transfer device, the chip is buffered when the chip is adsorbed, the situation that the chip is damaged due to excessive pressure in the chip adsorption process is effectively overcome, and the lossless transfer of the chip is achieved. The invention further discloses a chip repair device with the adsorption type chip transfer device.