Vapor chamber plate radiator

Abstract

The invention discloses a vapor chamber radiator. The radiator comprises a radiator main body, a liquid absorption core, radiating fins and a cold liquid working medium, the radiator main body comprises a vapor chamber shell and a vapor chamber cover plate, the vapor chamber cover plate is fixedly connected to the side surface of the vapor chamber shell, and the radiating fins are fixedly connected to the outer part of the radiator main body; and the cold liquid working medium and the liquid absorption core are arranged in the radiator main body. According to the vapor chamber plate radiator, the radiator is manufactured on the basis of the vapor chamber plate, so the problem that a traditional radiator is low in heat conduction coefficient is well solved; a substrate of a common profile radiator is replaced with a uniform temperature plate structure to improve the heat conduction performance of the substrate of the profile radiator, a single-point heat source relatively concentrated by diodes is rapidly conducted and distributed to the side surface of a substrate, and then the heat is dissipated in a natural heat dissipation mode of heat dissipation tooth pieces, so that the heat conductivity coefficient of the radiator in use is greatly improved, the overall structure is simple, and the radiator is relatively practical in use.

Description

technical field [0001] The invention relates to the technical field of radiators, in particular to a vapor chamber radiator. Background technique [0002] With the requirements of integration, light weight and miniaturization of airborne electronic design, the heat flux density of electronic equipment is increasing, and the thermal design of electronic equipment has become a key issue in the design of airborne electronic products. High-power diodes are widely used in airborne electronic equipment, and the thermal design of high-power diodes is also a major problem in the thermal design tasks of many airborne electronic equipment. [0003] The conventional profile radiators currently on the market can no longer meet the heat dissipation requirements of high-power diodes. In the airborne electronic equipment group, the conventional profile radiators are made of aluminum alloy, and the thermal conductivity of aluminum alloy is about (120-205) W / m•℃, its thermal conductivity is...

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides a vapor chamber radiator, which solves the problem that conventional profile radiators on the market cannot meet the heat dissipation requirements of high-power diodes. In the airborne electronic equipment group, conventional profiles The material of the radiator is made of aluminum alloy. The thermal conductivity of the aluminum alloy is about (120-205) W / m·℃. It can't reduce the thermal resistance of the radiator well, and there are certain limitations in application.

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