The application discloses a kind of single
abrasive grain ultrasonic
grinding temperature field numerical
simulation method, comprising: S100. Establish single
abrasive grain ultrasonic
grinding model, determine the motion trajectory when
abrasive grain grinds workpiece;S200. Calculate the
heat flow intensity of workpiece when abrasive grain grinds workpiece, according to the motion trajectory of abrasive grain, establish the heat
source model of
Gaussian distribution;S300. Establish the temperature field
algorithm model of workpiece, the specific process includes: S301. The heat conduction process of workpiece is simplified as two-dimensional heat conduction, establishes two-dimensional heat conduction
partial differential equation;S302. According to the heat
source model of step S200, establish the calculation equation of temperature field generated by arbitrary
point heat source to workpiece;S303. Simultaneous solution two-dimensional heat conduction
partial differential equation and the calculation equation of temperature field generated by arbitrary
point heat source to workpiece. In the application, the temperature field of workpiece in
grinding area during single abrasive grain ultrasonic
grinding process can be quickly predicted, the problem of temperature increasing effect caused by time-varying movable heat source can be solved simultaneously, the calculation result is very accurate, and the application is suitable for popularization and use.