Multi-channel wick-embedded flat plate heat pipe

Abstract

The invention discloses a multi-channel wick-embedded flat plate heat pipe, which consists of a high thermal conductivity substrate, wicks and working media, wherein the inner side of an upper surface of the substrate is provided with an upper narrow hollow cavity while the inner side of a lower surface of the substrate is provided with a lower narrow hollow cavity, communication channels are arranged between the upper narrow hollow cavity and the lower narrow hollow cavity and penetration channels are also arranged among the communication channels; the wicks are arranged on the surface of the lower narrow hollow cavity, the upper narrow hollow cavity, the communication channels and the penetration channels; and the working media are positioned in the upper narrow hollow cavity, the lower narrow hollow cavity the penetration channels and the communication channels inside the substrate. The multi-channel wick-embedded flat plate heat pipe not only greatly increases the effective heat exchange area for evaporation and condensation, but can also realize the rapid diffusion and spread of heat, generated by a plurality of local high heat flow point heat sources, towards large cooling surface, thereby achieving the purpose of enhancing temperature evenness at the heated surface and reducing the temperature on the surface of electronic equipment in order to further guarantee safe, stable and efficient operation of electronic equipment system.

Description

technical field [0001] The invention relates to the heat dissipation of an electronic equipment system used for multiple local high heat flux heat sources, in particular to a multi-channel embedded liquid-absorbing core type flat heat pipe. Background technique [0002] With the continuous development of electronic technology, the power of electronic equipment systems is getting larger and smaller, but the physical size is getting smaller and smaller, and the heat flux is also increasing sharply. If the heat generated by the electronic equipment system cannot be dissipated in time, the system temperature will rise sharply. Existing studies have shown that when the temperature of electronic components rises by 10°C, their working efficiency will decrease by more than 50%. Therefore, how to realize efficient heat dissipation of electronic devices is very important to improve the reliability and stability of their systems. In an electronic equipment system, the reliability of ...

AI Technical Summary

Problems solved by technology

If the temperature uniformity and heat transfer capacity indicators do not meet the requirements, it will greatly reduce the performance of electronic components, and in some cases even cause the entire circuit board to burn out

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