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Artificial graphite film heat conduction and heat dissipation material with composite structure and preparation method of artificial graphite film heat conduction and heat dissipation material with composite structure

A technology of artificial graphite and composite structure, which is applied in the direction of semiconductor devices, semiconductor/solid-state device parts, electrical components, etc., can solve the problems of poor heat dissipation, low thermal conductivity, and low surface black body radiation coefficient, and achieve the goal of improving heat dissipation performance Effect

Pending Publication Date: 2017-03-22
国成仪器(常州)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The first object of the present invention is to solve the low thermal conductivity of the natural graphite heat dissipation film described in the background technology, while the artificial graphite film has a high thermal conductivity, but its surface black body radiation coefficient is low and the heat dissipation effect is poor To solve the problem, provide a composite structure artificial graphite film heat conduction and heat dissipation material

Method used

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  • Artificial graphite film heat conduction and heat dissipation material with composite structure and preparation method of artificial graphite film heat conduction and heat dissipation material with composite structure
  • Artificial graphite film heat conduction and heat dissipation material with composite structure and preparation method of artificial graphite film heat conduction and heat dissipation material with composite structure
  • Artificial graphite film heat conduction and heat dissipation material with composite structure and preparation method of artificial graphite film heat conduction and heat dissipation material with composite structure

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Effect test

Embodiment 1

[0028] Such as figure 1 As shown, a composite structure artificial graphite film heat conduction and heat dissipation material and a preparation method thereof are composed of a heat dissipation layer A and a heat conduction layer B from top to bottom, and the preparation method includes the following steps:

[0029] Step 1. First put the polyimide film into the carbonization furnace, carbonize it at a heating temperature of 1200°C for 10 hours, then continue to graphitize it in the graphitization furnace at a temperature of 2800°C for 24 hours, cool to room temperature and roll to form Artificial graphite heat conduction layer B.

[0030] Step 2, take raw materials according to the following mass percentages to configure heat dissipation slurry: 45% water-based epoxy resin, 30% effective heat dissipation material (10% graphene+10% carbon nanotubes+10% carbon nanospheres), 10% boron nitride, 5% polyamide wax, 5% propylene glycol and 5% fatty acid, mix the above raw materials,...

Embodiment 2

[0033] Such as figure 2 As shown, a composite structure artificial graphite film heat conduction and heat dissipation material and a preparation method thereof are composed of a heat dissipation layer A, a transition layer C and a heat conduction layer B from top to bottom, and the preparation method includes the following steps:

[0034] Step 1. First put the polyimide film into a carbonization furnace, carbonize it at a heating temperature of 1200°C for 10 hours, then continue to graphitize it in a graphitization furnace at a temperature of 2800°C for 24 hours, and cool it down to room temperature to form a heat conduction layer precursor body.

[0035] Step 2, take the following mass percentages and use raw materials to configure heat-dissipating slurry: 97.7% solvent-based polyurethane, 1% graphene, 1% silicon carbide, 0.1% modified urea solution, 0.1% glycerin and 0.1% Mineral oil, mix the above raw materials, and stir at a temperature of 50°C at a speed of 5000 rpm for...

Embodiment 3

[0039] Such as image 3 As shown, a composite structure artificial graphite film heat conduction and heat dissipation material and its preparation method are composed of heat dissipation layer A, heat conduction layer B and heat dissipation layer A from top to bottom, and the preparation method includes the following steps:

[0040] Step 1. Firstly, flake graphite is treated with nitric acid and hydrogen peroxide to form expanded graphite, and rolled to obtain a graphite paper heat-conducting layer.

[0041] Step 2, take raw materials according to the following mass percentages to configure heat dissipation paste: 60% thermally conductive resin (including 25% solvent-based polyurethane resin, 25% solvent-based epoxy resin and 10% solvent-based acrylic resin), 25% effective heat dissipation material (5% graphene+5% carbon nanotube+15% carbon nanosphere), 5% silicon carbide, 3% propylene glycol, 4% polyamide wax and 3% mineral oil are mixed, the above-mentioned raw materials are...

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Abstract

The invention discloses an artificial graphite film heat conduction and heat dissipation material with a composite structure and a preparation method of the artificial graphite film heat conduction and heat dissipation material with the composite structure. The artificial graphite film heat conduction and heat dissipation material with the composite structure comprises a heat conduction layer A and a single-sided or double-sided heat dissipation layer B, wherein the heat dissipation layer is directly combined with the heat conduction layer or is combined with the heat conduction layer through combining a transition layer C; the composite structure of the heat dissipation material is an AB type, an ACB type, an ABA type, an ACBCA type or an ACBA type; the heat conduction layer has a relatively high heat conduction coefficient and a point heat source subjected to heat dissipation is dispersed into a surface heat source; and the heat dissipation layer has a relatively high black-body radiation coefficient and has relatively high absorption capacity on heat of the heat source and relatively high outward thermal radiation capacity. The preparation method of the artificial graphite film heat conduction and heat dissipation material with the composite structure comprises the following steps of (1) obtaining the heat conduction layer or a heat conduction layer precursor; (2) uniformly coating a single side or double sides of the heat conduction layer or the heat conduction layer precursor with heat dissipation layer slurry and drying to form the heat dissipation layer; and (3) carrying out calendaring to obtain the artificial graphite film heat conduction and heat dissipation material with the composite structure.

Description

technical field [0001] The invention relates to a heat conduction and heat dissipation composite material and a preparation method thereof, in particular to a composite structure artificial graphite film heat conduction heat dissipation material and a preparation method thereof, belonging to the field of electric conduction and heat conduction materials. Background technique [0002] With the rapid development of microelectronics integration technology, the size and volume of electronic components are shrinking sharply. The resulting heat dissipation difficulties have seriously affected the accuracy and life of electronic devices, and have become the technical bottleneck of device miniaturization. This restricts the further development of integrated technology. Traditional heat-conducting materials are mainly metal materials, such as copper, aluminum, silver, etc. However, metal materials have high density and high expansion coefficient, which cannot meet the application req...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/373
CPCH01L23/3735
Inventor 张泳董国材唐琪雯
Owner 国成仪器(常州)有限公司
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