Artificial graphite film heat conduction and heat dissipation material with composite structure and preparation method of artificial graphite film heat conduction and heat dissipation material with composite structure
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- 国成仪器(常州)有限公司
- Publication Date
- 2017-03-22
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Abstract
Description
technical field
[0001] The invention relates to a heat conduction and heat dissipation composite material and a preparation method thereof, in particular to a composite structure artificial graphite film heat conduction heat dissipation material and a preparation method thereof, belonging to the field of electric conduction and heat conduction materials. Background technique
[0002] With the rapid development of microelectronics integration technology, the size and volume of electronic components are shrinking sharply. The resulting heat dissipation difficulties have seriously affected the accuracy and life of electronic devices, and have become the technical bottleneck of device miniaturization. This restricts the further development of integrated technology. Traditional heat-conducting materials are mainly metal materials, such as copper, aluminum, silver, etc. However, metal materials have high density and high expansion coefficient, which cannot meet the application req...