High-heat-flow short-time working platform phase change temperature control assembly fin structure design method

Abstract

A high-heat-flow short-time working platform phase change temperature control assembly fin structure design method includes the steps that firstly, design working conditions are defined, heat conduction channels are designed, the structural layout of the heat conduction channels is designed by simulating growth of plant leaf veins, and the heat conduction channels extend from a point heat source to the interior of a phase change material to form a heat conduction enhanced network; then material reconstruction is carried out, and heat conduction channel units are screened by adopting a competitive mechanism; mathematical optimization is performed on a heat conduction channel model, and iterative optimization is performed to obtain an optimal heat conduction structure meeting the material consumption by taking the minimum total heuristic dissipation of a heat conduction divergence grid structure as an optimization objective function and the volume dissipation of a high-heat-conduction material as a constraint condition; and finally, adaptive treatment is performed, and rounding the bifurcated layout of the heat conductivity improving structure according to the production process requirements, thereby obtaining the final layout of the heat conduction structure. The heat conductivity of the phase-change material is improved while the energy storage capacity of the phase-change material is guaranteed, heat transfer in the material is enhanced, and the phase-change material can better play a role in energy storage.

Description

technical field [0001] The invention relates to the technical field of thermal conductivity improvement design of phase change materials, in particular to a fin structure design method for a phase change temperature control component of a high heat flow short-time working platform. [0002] technical background [0003] The problem of heat dissipation is one of the important factors restricting the performance improvement of high heat flow and short-time working equipment. Using phase change materials to dissipate heat is a low-cost and widely used method. Phase change materials can absorb a large amount of latent heat during the phase change process without causing temperature rise. However, ordinary phase change materials (such as paraffin) have low thermal conductivity, and the heat absorption efficiency is not ideal in practical applications, which limits high Performance electronic devices have the potential to further improve work efficiency, and even cause the problem ...

AI Technical Summary

Problems solved by technology

Phase change materials can absorb a large amount of latent heat during the phase change process without causing temperature rise. However, ordinary phase change materials (such as paraffin) have low thermal conductivity, and the heat absorption efficiency is not ideal in practical applications, which limits high Performance electronic devices have the potential to further improve work efficiency, and even cause the problem of overheating and failure due to heat accumulation; at the macro scale, inserting efficient heat-conducting bifurcated grids in phase-change materials is an effective method that can greatly improve Thermal Response Efficiency of Phase Change Materials

[0004] The commonly used high-efficiency heat-conducting bifurcated grids include metal foam and metal fins; the preparation process of metal foam is complicated and the preparation efficiency is low, and the structural parameters of metal foam cannot be effectively controlled and adjusted. Its thermal conductivity has a great influence, and it is difficult for metal foam to effectively improve the thermal conductivity of phase change materials; the preparation process of metal fins is relatively simple, but at present, most of the designs for the shape and topology of thermally conductive metal fins are not designed or even Subjectively determined; therefore, current bifurcated mesh design methods for efficient thermal conduction are difficult to meet the current requirements for enhancing the thermal conductivity of phase change materials

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