High-thermal-conductivity and low-expansion conductive pattern board and preparation method therefor

Abstract

The invention belongs to the technical field of electronic packaging and particularly relates to a high-thermal-conductivity and low-expansion conductive pattern board and a preparation method therefor. The preparation method comprises: by taking a high-thermal-conductivity and low-expansion composite material as a base material, preparing a high-thermal-conductivity insulation medium layer on single or both surfaces of the base material with a physical or chemical method of welding, gluing, chemical vapor deposition, magnetron sputtering or physical vapor deposition; and finally depositing a conductor circuit pattern layer on the insulation medium layer with a chemical vapor deposition technology, a magnetron sputtering technology, a physical vapor deposition technology or an etching method so as to obtain the lamellar high-thermal-conductivity and low-expansion conductive pattern board. The conductive pattern board has the properties of high breakdown strength, high dielectric constant and the like in addition to high thermal conductivity, low expansion coefficient, high strength and high size stability; and a conductor circuit pattern is directly formed on a substrate, so that a preparation process for the conductor circuit pattern layer is simplified.

Description

technical field [0001] The invention belongs to the technical field of electronic packaging, and in particular relates to a high thermal conductivity and low expansion conductive graphic board and a preparation method thereof. Background technique [0002] With the rapid development of the electronic information industry, the size of electronic products is getting smaller and smaller, and the power density is getting higher and higher. Solving the problem of heat dissipation is a huge challenge for the design of the electronics industry. With its excellent heat dissipation performance, machining performance, electromagnetic shielding performance, dimensional stability, magnetic performance and multifunctional performance, metal substrates are widely used in hybrid integrated circuits, automobiles, motorcycles, office automation, high-power electrical equipment, power supply equipment and other fields. , has been used more and more, especially as a substrate in LED packaging ...

AI Technical Summary

Problems solved by technology

The traditional metal substrate is based on a metal plate (aluminum, copper, iron, etc.), and an insulating dielectric layer and a conductive layer (copper foil) are covered on the substrate. It is 398W / mK, but there are disadvantages such as large thermal expansion coefficient, heavy weight, and difficulty in anti-oxidation treatment of the end surface.

The density of the aluminum substrate is small, and the thermal conductivity is 237W / mK, but there is also the problem of a large thermal expansion coefficient, and the printed circuit board produced produces noise during operation on the parts equipped with switching elements, power supplies, and power amplifier elements.

The iron substrate has electromagnetic properties that other metal substrates do not have, and has the advantages of good dimensional stability and low price, but it has the problems of heavy weight, corrosion resistance, and poor thermal conductivity.

Traditional metal substrates can no longer meet the needs of the development of high-power electronic devices, so it is necessary to develop substrates with higher performance such as high thermal conductivity, low thermal expansion coefficient, and light weight