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A kind of diamond/aluminum composite material and its low-cost preparation method

An aluminum composite material and diamond technology, which is applied in the field of diamond/aluminum composite material and its preparation, can solve the problems of low thermal conductivity and high preparation cost, and achieve the effects of improving thermal conductivity, improving interface bonding strength and saving costs.

Active Publication Date: 2019-05-17
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention proposes a diamond / aluminum composite material and its low-cost preparation method in order to solve the problems of harmful interfacial reactants, low thermal conductivity and high preparation cost of the diamond / aluminum composite material prepared in the prior art

Method used

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  • A kind of diamond/aluminum composite material and its low-cost preparation method
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  • A kind of diamond/aluminum composite material and its low-cost preparation method

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specific Embodiment approach 1

[0040] Embodiment 1: The diamond / aluminum composite material of this embodiment is composed of aluminum metal and diamond powder with a coating layer, and the aluminum metal is filled in the gap of the diamond powder with a coating layer;

[0041] The aluminum metal is pure aluminum or aluminum alloy;

[0042] The coating layer of the diamond powder with coating layer is one layer or more than two layers;

[0043] The material of the coating layer is Ti, Cr, W, Mo or Zr;

[0044] The volume fraction of diamond powder in the diamond / aluminum composite material is 61%-70%.

[0045] This embodiment has the following beneficial effects:

[0046] The density of the diamond / aluminum composite material of the method of this embodiment reaches more than 99.8%, which solves the problem of low density of the diamond / aluminum composite material prepared in the prior art; the surface of the single crystal diamond powder is coated to improve the diamond powder. The wettability with alum...

specific Embodiment approach 2

[0047] Embodiment 2: This embodiment is different from Embodiment 1 in that: the thickness of the coating layer is 30-500 nm. Other steps and parameters are the same as those in the first embodiment.

specific Embodiment approach 3

[0048] Embodiment 3: This embodiment is different from Embodiment 1 or Embodiment 2 in that: the particle size of the diamond powder is 10-300 μm. Other steps and parameters are the same as those in Embodiment 1 or 2.

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Abstract

A diamond / aluminum composite material and a low-cost preparation method thereof relate to a diamond / aluminum composite material and a preparation method thereof. The invention aims to solve the problems of harmful interfacial reactants, low thermal conductivity and high preparation cost of the diamond / aluminum composite material prepared in the prior art. The diamond / aluminum composite material is composed of aluminum metal and diamond powder with a coating layer, and aluminum metal is filled in the gap of the diamond powder with a coating layer. Preparation: 1. Preparation of near net shape mold; 2. Surface coating treatment of diamond powder; 3. Air pressure infiltration preparation; 4. Air pressure infiltration; 5. Demoulding. The density of the diamond / aluminum composite material obtained by the method of the present invention is more than 99.8%, the preparation method saves aluminum metal, improves the interface bonding strength between diamond powder and aluminum metal, and solves the problem of thermal conductivity of the existing diamond / aluminum composite material low problem. The invention is suitable for preparing diamond / aluminum composite material.

Description

technical field [0001] The invention relates to a diamond / aluminum composite material and a preparation method thereof Background technique [0002] The rapid development of the electronics industry in recent years has made the power consumption of the circuit more and more large, which has seriously increased the reliability and life expectancy requirements of key electronic components such as chips. In the field of electronic communication, the power consumption of chips is increasing at an annual rate of more than 50%. Existing electronic packaging materials used for heat conduction, such as molybdenum copper, tungsten copper, and silicon carbide aluminum, have become increasingly difficult to meet the needs of the industry, and have even become a bottleneck restricting the development of the industry. The thermal conductivity of diamond / aluminum composite materials is more than twice that of molybdenum or copper, and has an appropriate thermal expansion coefficient, whi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C26/00C22C1/10
CPCC22C1/101C22C1/1036C22C26/00C22C1/1073
Inventor 武高辉丁伟张强苟华松陈国钦修子扬姜龙涛康鹏超杨文澍
Owner HARBIN INST OF TECH
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