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Thermally-conductive and electrically-conductive adhesive and preparation method and application thereof

A technology for conductive adhesives and uses, applied in the direction of adhesives, epoxy resin adhesives, adhesive types, etc., can solve the problems affecting the solderability of conductive adhesives, increase the viscosity of conductive adhesives, and adversely apply conductive adhesives, and achieve accelerated curing. process, good weldability, good mechanical properties

Pending Publication Date: 2017-06-23
SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In order to solve the problem of poor conductive interconnection performance in thermally conductive adhesives, some researchers currently use methods to increase the filler content to greatly improve thermal conductivity, but high filler content will bring higher costs; the resin matrix is ​​conductive. The adhesive plays a bonding role, so increasing the filler content will reduce the resin content, thereby affecting the solderability of the conductive adhesive; at the same time, it will cause an increase in the viscosity of the conductive adhesive, which may cause wire-drawing tailing during high-speed dispensing and other phenomena, which is not conducive to the application of conductive adhesive
These limit the application of conductive adhesive

Method used

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  • Thermally-conductive and electrically-conductive adhesive and preparation method and application thereof
  • Thermally-conductive and electrically-conductive adhesive and preparation method and application thereof
  • Thermally-conductive and electrically-conductive adhesive and preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] A heat-conducting and electrically-conducting adhesive, which consists of 15 parts of a resin matrix and 85 parts of a low-melting-point alloy filler in parts by mass;

[0048] The resin matrix is ​​composed of bisphenol A diglycidyl ether, methyl hexahydrophthalic anhydride, amine curing agent, neopentyl glycol glycidyl ether, 1,6-hexanediol diglycidyl ether, hydrogenated castor oil, diethyl Tetramethylimidazole, polymerized rosin and acrylic resin modified maleic rosin are mixed according to the weight ratio of 100:80:2:1:1:2:1:1:1; the low melting point alloy filler is Cu, Ag, SnBi, SnBiAg, SnBiCu and SnInBi filler powders are mixed according to the weight ratio of 1:1:80:20:5:5.

[0049] The preparation method of the thermally conductive adhesive comprises the following steps:

[0050] Step 1, mixing the low melting point alloy filler and the resin matrix in proportion;

[0051] Step 2. Put the mixing tank into the mixer and vacuum mix the mixture evenly;

[0052...

Embodiment 2

[0054] A heat-conducting and electrically-conducting adhesive, which consists of 12 parts of a resin matrix and 88 parts of a low-melting-point alloy filler in parts by mass;

[0055] The resin matrix is ​​composed of bisphenol A diglycidyl ether, methyl hexahydrophthalic anhydride, neopentyl glycol glycidyl ether, 1,6-hexanediol diglycidyl ether, diethylene glycol glycidyl ether, hydrogenated castor oil, Ethylene bis-stearin, imidazole, hydrogenated rosin, and maleic rosin are mixed according to the weight ratio of 100:85:2:1:1:2:1:2:1:1; the low melting point alloy filler is Cu, Ag, SnBi, SnBiCu and SnIn filler powders are mixed according to the weight ratio of 1:1:60:20:5.

[0056] The preparation method of the thermally conductive adhesive comprises the following steps:

[0057] Step 1, mixing the filler and the resin matrix in proportion;

[0058] Step 2. Put the mixing tank into the mixer and vacuum mix the mixture evenly;

[0059] Step 3, the slurry after mixing is t...

Embodiment 3

[0061] A heat-conducting and electrically-conducting adhesive, which consists of 10 parts of a resin matrix and 90 parts of a low-melting-point alloy filler in parts by mass;

[0062] The resin matrix is ​​composed of bisphenol F epoxy resin, aliphatic epoxy resin, 2-ethyl-4-methylimidazole, 2-undecylimidazole, 1,4-butanediol glycidyl ether, neopentyl Glycidyl ether, hydrogenated castor oil, triethylamine, and maleic rosin are mixed according to the weight ratio of 85:15:70:10:2:3:2:2:3; the low melting point alloy filler is Cu, Ag , SnBiAg, SnBiCu and SnIn filler powders are mixed according to the weight ratio of 1:1:75:25:5.

[0063] The preparation method of the thermally conductive adhesive comprises the following steps:

[0064] Step 1, mixing the filler and the resin matrix in proportion;

[0065] Step 2. Put the mixing tank into the mixer and vacuum mix the mixture evenly;

[0066] Step 3, the slurry after mixing is the obtained conductive adhesive.

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Abstract

The invention relates to a thermally-conductive and electrically-conductive adhesive and a preparation method and application thereof. The thermally-conductive and electrically-conductive adhesive comprises the following components in percentage by mass: 5-20% of epoxy resin, 75-90% of a low-melting point alloy filler, 1-10% of a curing agent, 0.1-3% of an accelerant and 0.1-10% of a diluent, and can further comprise a film-forming agent and a thixotropic agent. The preparation method comprises the following steps: mixing the components, and performing vacuum mixing on an obtained mixture for 3-5min to obtain a uniform pasty material, namely the thermally-conductive and electrically-conductive adhesive. The thermally-conductive and electrically-conductive adhesive provided by the invention can achieve good metallurgical interconnection after being cured at low temperature, so that the thermally-conductive and electrically-conductive adhesive not only has good welding capability, but also has good thermal conductivity and electrical conductivity.

Description

technical field [0001] The invention relates to the technical field of integrated circuit chip packaging materials, in particular to a thermally conductive adhesive and its preparation method and application, and in particular to a low-melting point alloy powder filler thermally conductive adhesive and its preparation method and application. Background technique [0002] In traditional electronic packaging, thermal and conductive powder fillers such as metal silver and copper are mainly used. The powders are only in physical contact, and there are problems of high contact thermal resistance and electrical resistance, resulting in low thermal conductivity and electrical conductivity of the glue, which cannot be realized. Excellent high electrical and thermal conductivity. [0003] Epoxy resin has excellent physical and mechanical properties and bonding properties. At the same time, it also has the characteristics of wide curing temperature range, easy control of crosslinking ...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J11/04C09J11/06C09J11/08
CPCC08L2205/025C08L2205/035C09J11/04C09J11/06C09J11/08C09J163/00C09J2203/326C09J2301/314C08L91/00C08L93/04C08K13/02C08K5/06C08K2003/0806C08K2003/085
Inventor 符显珠康佳慧孙蓉
Owner SHENZHEN INST OF ADVANCED TECH CHINESE ACAD OF SCI
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