A kind of diamond/aluminum composite material and high-efficiency preparation method thereof

An aluminum composite material and diamond technology, which is applied in the field of diamond/aluminum composite material and its preparation, can solve the problems of insufficient interface reaction between diamond and aluminum, weak interface bonding, low thermal conductivity, etc., so as to meet the forming accuracy and improve the interface The effect of bonding strength and improving thermal conductivity

Active Publication Date: 2019-05-17
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention proposes a diamond / aluminum composite material and its high efficient preparation method

Method used

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  • A kind of diamond/aluminum composite material and high-efficiency preparation method thereof
  • A kind of diamond/aluminum composite material and high-efficiency preparation method thereof
  • A kind of diamond/aluminum composite material and high-efficiency preparation method thereof

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specific Embodiment approach 1

[0043] Embodiment 1: In this embodiment, a diamond / aluminum composite material is composed of aluminum metal and diamond powder with a coating layer, and the aluminum metal is filled in the gap of the diamond powder with a coating layer;

[0044] The aluminum metal is pure aluminum or aluminum alloy;

[0045] The coating layer of the diamond powder with coating layer is one layer or more than two layers;

[0046] The material of the coating layer is Ti, Cr, W, Mo or Zr;

[0047] The volume fraction of diamond powder in the diamond / aluminum composite material is 50%-60%.

[0048] This embodiment has the following beneficial effects:

[0049] The compactness of the diamond / aluminum composite material in this embodiment reaches more than 99.8%, which solves the problem of low density of the diamond / aluminum composite material; the coating layer on the surface of the single crystal diamond powder in this embodiment improves the bond between diamond powder and aluminum Wettabili...

specific Embodiment approach 2

[0050] Embodiment 2: This embodiment is different from Embodiment 1 in that: the thickness of the coating layer is 30-500 nm. Other steps and parameters are the same as those in the first embodiment.

specific Embodiment approach 3

[0051] Embodiment 3: This embodiment is different from Embodiment 1 or Embodiment 2 in that: the particle size of the diamond powder is 10-300 μm. Other steps and parameters are the same as those in Embodiment 1 or 2.

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Abstract

A diamond / aluminum composite material and a high-efficiency preparation method thereof relate to a diamond / aluminum composite material and a preparation method thereof. The invention aims to solve the problems of weak interface bonding, low thermal conductivity, insufficient interface reaction between diamond and aluminum, low impregnation efficiency and low density of the diamond / aluminum composite material prepared in the prior art. The diamond / aluminum composite material is composed of aluminum metal and diamond powder with a coating layer, and aluminum metal is filled in the gap of the diamond powder with a coating layer. Methods: 1. Preparation of near-net molding mold; 2. Surface coating of diamond powder; 3. Air pressure infiltration preparation; 4. Air pressure infiltration; 5. Demoulding. The density of the diamond / aluminum composite material of the invention reaches more than 99.8%, which improves production efficiency, reduces raw material costs, and improves interface bonding strength and thermal conductivity. The invention is suitable for preparing diamond / aluminum composite material.

Description

technical field [0001] The invention relates to a diamond / aluminum composite material and a preparation method thereof Background technique [0002] The rapid development of the electronics industry in recent years has made the power consumption of the circuit more and more large, which has seriously increased the reliability and life expectancy requirements of key electronic components such as chips. In the field of electronic communication, the power consumption of chips is increasing at an annual rate of more than 50%. Existing electronic packaging materials used for heat conduction, such as molybdenum copper, tungsten copper, and silicon carbide aluminum, have become increasingly difficult to meet the needs of the industry, and have even become a bottleneck restricting the development of the industry. The thermal conductivity of diamond / aluminum composite materials is more than twice that of molybdenum or copper, and has an appropriate thermal expansion coefficient, whi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C26/00C22C1/10
CPCC22C1/1036C22C26/00C22C1/1073
Inventor 武高辉丁伟张强苟华松陈国钦修子扬姜龙涛康鹏超杨文澍
Owner HARBIN INST OF TECH
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