Method for shaping table surface of semiconductor chip

Abstract

The invention discloses a method for shaping the table surface of a semiconductor chip. The method comprises the following steps: using a grinding wheel rotating at a high speed, forming a groove corresponding to the needed groove shape in the grinding wheel, plating a grinding layer in the groove, and after the cylindrical surface of a chip ending terminal on the chip to be machined stretches in the groove, shaping the table surface by means of contacting with the groove and grinding. The method disclosed by the invention has the advantages of being convenient and efficient, simple in process, high in yield, low in manufacturing cost, and the like.

Description

technical field [0001] The invention mainly relates to the manufacturing field of semiconductor chips, in particular to a mesa modeling method suitable for semiconductor chips. Background technique [0002] In high-voltage power semiconductor devices, the reverse withstand voltage of the PN junction usually does not meet the design requirements, the main reason is that surface breakdown occurs. In order to reduce the adverse effects of surface effects and thereby improve the blocking capability of planar semiconductor devices, it is usually necessary to treat the junction terminals of the devices. [0003] So far, many high-voltage junction termination technologies have been developed, such as field limiting ring method (FLR), field plate method (FP), mesa (bevel) molding method, corrosion molding method, junction termination extension method, semi-insulating polysilicon technology (SIPOS ), junction termination extension technology (JTE), weakened surface electric field te...

AI Technical Summary

Problems solved by technology

[0006] (1) Due to the problem of the processing direction, the traditional mechanical grinding method cannot process the double positive angle table shape (the end face is dovetail shape);

[0007] (2) The efficiency is low, only one surface of the chip 2 can be ground at one angle at a time, and the grinding disc 1 needs to be replaced every time the grinding of one angle is completed;

[0008] (3) Since the grinding of each angle is independent of each other, the risk is that the coordination effect designed by each angle becomes worse;

[0009] (4) The width of the table is not easy to control. Since the table is always in a state of contact grinding, it is difficult for the operator to accurately control the width of the table;

[0010] (5) Since the terminal of the chip 2 after cutting the circle is at a right angle, and the cutting surface is relatively rough, there is a certain degree of mechanical damage, so edge chipping and slivers are prone to occur during the beveling process, resulting in the scrapping of the device

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