Display panel, flexible circuit board and display module

A flexible circuit board and display panel technology, applied in the direction of circuits, printed circuits, printed circuits, etc., can solve the problems affecting the bonding yield and dislocation, so as to improve the bonding yield, reduce the dislocation, and better match the incoming materials and Effects of process tolerances

Active Publication Date: 2019-03-08
XIAMEN TIANMA MICRO ELECTRONICS
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the bonding process, due to the difference between the thermal expansion coefficient of the flexible circuit board and the thermal expansion coefficient of the display panel substrate, there is a misalignment between the input pad and the output pad during the bonding process, which affects the bonding yield

Method used

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  • Display panel, flexible circuit board and display module
  • Display panel, flexible circuit board and display module
  • Display panel, flexible circuit board and display module

Examples

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Embodiment Construction

[0033] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that unless specifically stated otherwise, the relative arrangement of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention.

[0034] The following description of at least one exemplary embodiment is actually only illustrative, and in no way serves as any limitation to the present invention and its application or use.

[0035] The technologies, methods, and equipment known to those of ordinary skill in the relevant fields may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be regarded as part of the specification.

[0036] In all examples shown and discussed herein, any specific value should be interpreted as merely exemplary, rather than as a limitation. Therefore, other examples of th...

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PUM

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Abstract

The invention discloses a display panel, a flexible circuit board and a display module. The display panel comprises a substrate and at least one row of input bonding pads arranged in a first direction, arranged in a binding region of the substrate; the first input bonding pads extend in a second direction; the second input bonding pads form second input bonding pad groups; the two second input bonding pad groups are located on the two sides of a first input bonding pad group respectively; each input bonding pad comprises a first end and a second end; an interval between any two adjacent inputbonding pads includes a first interval and a second interval; in each second input bonding pad group, the first interval and the second interval between the two adjacent second input bonding pads arenot equal; the first input bonding pad groups point to the second input bonding pad groups; and from the first input bonding pads and the second input bonding pads, which are adjacent, the first intervals are gradually increased in sequence, and the second intervals are gradually increased in sequence. The dislocation between the input bonding pads and output bonding pads in the binding process can be effectively reduced, thereby improving the binding yield.

Description

Technical field [0001] The present invention relates to the field of display technology, and more specifically, to a display panel, a flexible circuit board and a display module. Background technique [0002] In the field of display technology, in order to realize the display of the display panel, the main driving chip is required to provide electrical signals to various circuit traces provided in the display panel. The prior art usually sets up a flexible circuit board to realize the main driving chip and the circuit in the display panel. The electrical connection of the trace. Generally, input pads are provided on the display panel, and output pads are provided on the flexible circuit board, and the input pads and the output pads are bonded and connected in a one-to-one correspondence through anisotropic conductive glue. In the bonding manufacturing process, due to the difference between the thermal expansion coefficient of the flexible circuit board and the substrate of the d...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/11G09F9/30
CPCG09F9/30H05K1/118H01L23/49838H01L23/4985H05K1/111H05K1/189H05K2201/094H05K2201/09418H05K2201/10128H05K2203/166H01L27/124H05K1/147H05K3/361
Inventor 伍黄尧吴树茂赖国昌
Owner XIAMEN TIANMA MICRO ELECTRONICS
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