Touch control display device

Abstract

The invention discloses a touch control display device. The touch control display device comprises a display flexible circuit board and a touch control flexible circuit board which are bound to different sides of the touch control display device respectively. The touch control display device can effectively enlarge a gap between a seal cover plate and a display panel during adhesion of the seal cover plate, so that ultraviolet light illuminates optical cement more easily, the curing yield of the optical cement is improved, and the follow-up cement overflow defect is avoided. In addition, avoidance of the structures including a black array, a polaroid and the like is designed on a binding area of the touch control flexible circuit board so that the binding state of the touch control flexible circuit board can be monitored under a microscope after binding of the touch control flexible circuit board is completed, and the binding yield is improved.

Description

technical field [0001] The present invention relates to the field of display technology, in particular to a touch display device. Background technique [0002] With the development of display technology, the existing touch technology mainly includes two modes of ONCELL and IN CELL. The structure of the existing plug-in touch display device is as follows: figure 1 As shown, from top to bottom, it includes: package cover plate 101, optical glue 102, upper polarizer 103, color filter substrate 104, array substrate 105, lower polarizer 106, and backlight. Wherein, the driving chip 107 and the display flexible circuit board 108 are bound to the terminal of the array substrate 105 , and the touch flexible circuit board 109 is bound to the terminal of the color filter substrate 104 . [0003] The lamination of the optical adhesive 102 is to apply the liquid adhesive on the upper polarizer 103 by coating, and then attach the packaging cover plate 101 to the display panel below, an...

AI Technical Summary

Problems solved by technology

[0005] First of all, when the touch flexible circuit board 109 is bound, since the bottom is the black matrix area of ​​the display panel, it is impossible to detect the binding alignment state and the state of the conductive particles.

[0006] Secondly, when the packaging cover 101 is bonded, since there are both the driver chip 107 and the display flexible circuit board 108 on the terminal side, and the touch flexible circuit board 109 is sandwiched between the display panel and the packaging cover 101, so that the curing time The gap that can pass is very narrow, which is prone to the problem of incomplete curing, which leads to the hidden danger of progressive glue overflow and defects. This defect cannot be eliminated and monitored, and it has become a problem that is difficult to solve in the bonding process.

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