Stackable semiconductor encapsulation construct for multi-cylinder body

Abstract

The invention relates to a polycylinder stackable semiconductor packaging structure. The structure mainly comprises a wafer carrier, a wafer and a plurality of downwards convex block groups, wherein the wafer carrier has a plurality of switchover pads on an upper surface and a plurality of external pads on a lower surface; the wafer is arranged on and is electrically connected with the wafer carrier; the downwards convex block groups are correspondingly arranged on the external pads, and each downwards convex block group connected with each external pad consists of a plurality of conducting cylinders; and a solder filling gap is arranged between adjacent conducting cylinders of the same downwards convex block group. The stackable semiconductor packaging structure is used to increase welding area and perplex the shape of a welding interface, thereby achieving high durability of welding spots and reducing the growing possibility of cracks. In addition, the convex block group arranged on each external pad has the solder filling gap, solder can be filled and stored in the convex block group, so that a plaque does not extrude the solder to cause bridging short circuit even when inclined or warped; therefore, the structure is particularly suitable for practical use.

Description

Technical field [0001] The present invention relates to a three-dimensional stacking technology of semiconductor packaging structures, in particular to a multi-pillar stackable semiconductor packaging structure, which can be applied to a high-density package-on-package module (Package-On-Package module, POP) structure. Background technique [0002] With the development trend of miniaturization of electronic products, the area on the surface of the printed circuit board that can be provided with semiconductor packaging structures is getting smaller and smaller. Therefore, there is a three-dimensional stacking technology of semiconductor packaging structures. A plurality of stackable semiconductor packaging structures are stacked on each other to form a package-on-package module (POP) to meet the small surface bonding area and high density. Requirements for component settings. However, soldering defects are a major problem in the bonding process of the package stack. The soldering ...

AI Technical Summary

Problems solved by technology

[0013] Another object of the present invention is to provide a novel multi-column stackable semiconductor package structure. The technical problem to be solved is to complicate the shape of the soldering interface of the bump group and reduce the possibility of crack growth. making it more practical

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