The utility model discloses a
copper jumper pin-free packaging structure with a side
tin climbing function, which comprises a
metal frame, a plurality of
chip packaging units arranged in a matrix mode are arranged on the
metal frame, and two Y-direction long connecting ribs and two X-direction long connecting ribs are arranged on the
peripheral side of each
chip packaging unit. The Y-direction long connecting rib is communicated with the two X-direction long connecting ribs; each
chip packaging unit comprises a chip
welding area arranged in the middle, a left
metal contact point and a right metal contact point, the left metal contact point and the right metal contact point are arranged on the left side and the right side of the chip
welding area, the right metal contact point is connected with the chip
welding area, and the left metal contact point is connected with the adjacent Y-direction long connecting rib and the X-direction long connecting rib. And the
semiconductor chip is connected with the left side metal contact point through a
copper jumper wire. According to the utility model, the
copper jumper wire is adopted for welding, the welding reliability is improved, the external metal contact point realizes a complete
tin climbing function, and the welding firmness of a product is improved.