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340results about How to "Improve welding reliability" patented technology

Large K-waveband conformal antenna array plane and preparation method thereof

ActiveCN106099337AGood axial ratioWide bandwidth and good angular axis ratioParticular array feeding systemsRadiating elements structural formsMicrostrip patch antennaElectrical conductor
The invention discloses a large K-waveband conformal antenna array plane and aims to provide a conformal phased array antenna array plane which does not generate a frequency deviation or a relatively high derotation component, and has a good broadband wide-angle scanning gain characteristics and good broadband wide-angle scanning circular polarization characteristics. The large K-waveband conformal antenna array plane is realized through the following technical scheme: conductor patches are divided into four groups and are arranged on an upper surface of a lower dielectric substrate in a form of a quadrant sequence rotation array, and projections of feeding points of a micro-strip patch antenna on a plane plate are arranged triangularly; the conductor patches are sandwiched between an upper dielectric substrate and the lower dielectric substrate; a radio frequency coaxial connector sequentially passes through the plane plate, a metal cone and the lower dielectric substrate to jointly form the micro-strip patch antenna; the radio frequency coaxial connector carries out coaxial probe feeding on the micro-strip patch antenna; and a pair of orthogonal polarization degenerate modes which have equal amplitudes and a phase difference of 90 degrees are excited on the conductor patches to form the conformal phased array antenna array plane for radiating right-handed circular polarization electromagnetic waves.
Owner:10TH RES INST OF CETC

Silicon-based pressure sensor and manufacturing method thereof

The invention relates to a silicon-based pressure sensor and a manufacturing method thereof. The sensor comprises a differential pressure sensitive device, a static pressure compensation unit and a packaging structure, wherein the differential pressure sensitive device employs a differential capacitor structure, the differential pressure sensitive device is characterized in by comprising an upper glass fixing pole board, a movable silicon sensitive chip pole board, a lower glass fixing pole board, a glass bottom board and a pressure guide tube from up to down through packaging; the static pressure compensation unit employs a silicon piezoresistive chip in an absolute packaging mode to measure static pressure magnitude and is characterized by employing a point type suspension mode to be fixed above the differential pressure sensitive device, signal drifting amount is small, space is saved, and the static pressure compensation unit and the differential pressure sensitive device form a compound stacked structure welded in the packaging structure in a suspension mode; the packaging structure comprises a sensor foundation, a pressure leading guide tube and a wire leading seat and is characterized by employing a suspension type structure, the compound differential and static pressure structure is packaged in the sensor foundation in a suspension mode, the wire leading seat is arranged at one end of the foundation, the pressure leading guide tube is arranged at the other end of the foundation, each part is welded on the sensor foundation through the improved welding technology.
Owner:SHENYANG ACAD OF INSTR SCI

Stacking slice type piezoresistor and manufacturing method thereof

The invention provides a laminated slice type voltage-sensitive resistor and the manufacturing method of the voltage-sensitive resistor, which is suitable for electronic enterprises, the resistor comprises a lower cover, an upper cover, a voltage-sensitive resistor unit and a terminal electrode, wherein the voltage-sensitive resistor unit is arranged between the upper and the lower covers, the upper and the lower covers are made of ceramic protecting materials, the voltage-sensitive resistor unit is composed of an internal electrode, voltage-sensitive resistor film and ceramic protecting film, wherein the internal electrode and the voltage-sensitive resistor film are overprinted, the ceramic protecting film is overprinted on both sides of the overprinted internal electrode and the overprinted voltage-sensitive resistor film. The manufacturing method comprises the processes of batching, pulping, tape preparing, printing, hot-water voltage-sharing, slicing, dumping, sintering, end capping, electroplating and the like. The invention adopts the ceramic protecting materials and the method of overprinting the voltage-sensitive resistor film to form a homogenous, compact and moisture-proof protecting layer on the other four surfaces except both ends of the voltage-sensitive resistor, thereby the product can be easily electroplated with nickel and tin, and the reliability of the welding of the product is greatly improved.
Owner:SHENZHEN ZHENHUA FU ELECTRONICS

Stackable semiconductor encapsulation construct for multi-cylinder body

The invention relates to a polycylinder stackable semiconductor packaging structure. The structure mainly comprises a wafer carrier, a wafer and a plurality of downwards convex block groups, wherein the wafer carrier has a plurality of switchover pads on an upper surface and a plurality of external pads on a lower surface; the wafer is arranged on and is electrically connected with the wafer carrier; the downwards convex block groups are correspondingly arranged on the external pads, and each downwards convex block group connected with each external pad consists of a plurality of conducting cylinders; and a solder filling gap is arranged between adjacent conducting cylinders of the same downwards convex block group. The stackable semiconductor packaging structure is used to increase welding area and perplex the shape of a welding interface, thereby achieving high durability of welding spots and reducing the growing possibility of cracks. In addition, the convex block group arranged on each external pad has the solder filling gap, solder can be filled and stored in the convex block group, so that a plaque does not extrude the solder to cause bridging short circuit even when inclined or warped; therefore, the structure is particularly suitable for practical use.
Owner:POWERTECH TECHNOLOGY

Printed circuit board, manufacturing method thereof and electronic equipment

InactiveCN110149762AAvoid warpingAvoid the consequences of electrical connection failuresPrinted circuit assemblingPrinted circuits structural associationsSurface mountingEngineering
The embodiment of the invention provides a printed circuit board, a manufacturing method thereof and electronic equipment. The printed circuit board comprises a first printed circuit board. The firstprinted circuit board comprises a first surface and a second surface, and the first surface and the second surface are opposite in direction. The first printed circuit board is provided with a first groove, and an opening of the first groove faces the first surface. The first surface is provided with a first bonding pad. An electronic element is mounted on the second surface. The printed circuit board also comprises a second printed circuit board which comprises a third surface and a fourth surface, and the third surface and the fourth surface are opposite in direction. The third surface is provided with a second bonding pad, and the second bonding pad corresponds to the first bonding pad in position. The third surface and the fourth surface are respectively provided with electronic elements. The first printed circuit board and the second printed circuit board are welded through the first bonding pad and the second bonding pad to form a stacked structure. The printed circuit board provided by the invention is not likely to warp, has stronger stress deformation resistance, and can prolong the service life of electronic equipment.
Owner:HUAWEI TECH CO LTD

Method for actively sealing sapphire sheet and metal

The invention provides a method for actively sealing a sapphire sheet and metal. The method is low in welding temperature, high in efficiency, good in reliability and low in cost. According to the method, high-temperature metallization is not required, expensive vacuum coating equipment and precious metal targets are also not required, the defects of long intermediate treatment process and time consumption are overcome, the total welding time is shortened, and the production efficiency is improved; the defect that flatness with high precise size and demanding requirement is required to be machined when welding sheets are adopted is avoided, and active titanium, zirconium, copper and nickel welding flux is directly adopted; the thickness of the wall of the sealing part of a metal piece is small, so that the thermal stress effect caused by the reaction of extrusion to the metal piece by the thermal expansion of the sapphire sheet during welding is reduced, and the probability of explosion of the sapphire sheet is reduced; meanwhile, welding can be accomplished at one step when the vacuum atmosphere temperature is lower than 1000 DEG C, the requirement on welding equipment is low, the product welding reliability and the yield are high, the air impermeability is good when baking is performed at the high temperature of 560 DEG C for 36 hours, and the requirement on the air impermeability of ultrahigh frequency electron tubes can be guaranteed.
Owner:XI AN JIAOTONG UNIV +1

Welding device used for pipeline and using method of welding device

The invention discloses a welding device used for a pipeline and a using method of the welding device, and relates to the technical field of pipeline welding. The portability and the grinding quality are both considered. The welding device comprises a lower fixing seat and an upper fixing seat which are installed on the pipeline, the lower fixing seat is fixed to the outer walls of the two ends of the upper fixing seat through hinges and clamping buckles, and the lower fixing seat and the upper fixing seat are both of matched semicircular structures; and the using method of the welding device comprises the following steps that the lower fixing seat and the upper fixing seat are installed on the pipeline through the clamping buckles, and the position of a mounting frame is adjusted through fixing rotary knobs, so that all rolling wheels are attached to the outer wall of the pipeline. According to the pipeline and the using method of the welding device, the fixing rotary knobs, the rolling wheels, a welding mechanism and other structures are arranged, the lower fixing seat and the upper fixing eat can be installed on a to-be-welded pipeline, reliable welding is carried out on the pipeline in a mode of rotating on the outer wall of the pipeline, and therefore the welding flatness is guaranteed, meanwhile, the welding device can adapt to pipelines of different sizes, and the universality and the welding quality are improved.
Owner:刘少波
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