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Stacking slice type piezoresistor and manufacturing method thereof

A technology of varistors and varistors, which is applied in the fields of varistor cores, resistance manufacturing, varistors, etc., can solve the problems that the products are not easy to electroplate nickel, tin treatment, low pass rate, high production cost, etc. Achieve the effect of improving welding reliability, increasing pass rate, and solving performance deterioration

Active Publication Date: 2009-01-21
SHENZHEN ZHENHUA FU ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the manufacturing process, due to the wet forming is a single slurry forming at one time, coupled with the particularity of the varistor material, in the process of electroplating, the erosion of the material by the plating solution and the diffusion of electroplating will cause changes in the properties of the material, and the obtained The product is not easy to be electroplated with nickel and tin, so surface treatment is often required in the subsequent process, and the production cost of the product is high and the pass rate is low

Method used

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  • Stacking slice type piezoresistor and manufacturing method thereof
  • Stacking slice type piezoresistor and manufacturing method thereof

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Experimental program
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Effect test

Embodiment 1

[0052] The manufacturing method of the multilayer chip varistor provided in this embodiment includes the following steps:

[0053] (1) Powder preparation: use ceramic protective film materials and varistor film materials to manufacture corresponding powders respectively.

[0054] The piezoresistive film powder is ground with piezoresistive film material and uniformly mixed for 30 hours to a particle size of 1.0 μm, dried at 150°C, and sieved with 80 meshes. The components of the materials used and their contents (weight) are:

[0055] Zinc Oxide ZnO 85%

[0056] Bismuth oxide Bi 2 o 3 3.5%

[0057] Antimony oxide Sb 2 o 3 5%

[0058] Cobalt oxide Co 3 o 4 2%

[0059] Manganese Carbonate MnCO 3 0.5%

[0060] Chromium oxide Cr 2 o 3 1%

[0061] Nickel oxide Ni 2 o 3 1%

[0062] Aluminum nitrate Al(NO 3 ) 3 9H 2 O 0.01%

[0063] Silver nitrate AgNO 3 0.02%

[0064] boric aci...

Embodiment 2

[0095] The manufacturing method of the multilayer chip varistor according to the embodiment of the present invention includes the following steps:

[0096] (1) Powder preparation: use ceramic protective film materials and varistor film materials to manufacture corresponding powders respectively.

[0097] The piezoresistive film powder is ground with piezoresistive film material and uniformly mixed for 30 hours to a particle size of 1.0 μm, dried at 150°C, and sieved with 80 meshes. The components of the materials used and their contents (weight) are:

[0098] Zinc Oxide ZnO 85%

[0099] Bismuth oxide Bi 2 o 3 5%

[0100] Antimony oxide Sb 2 o 3 3.7%

[0101] Cobalt oxide Co 3 o 4 1.6%

[0102] Manganese Carbonate MnCO 3 1.5%

[0103] Chromium oxide Cr 2 o 3 0.8%

[0104] Nickel oxide Ni 2 o 3 1%

[0105] Aluminum nitrate Al(NO 3 ) 3 9H 2 O 0.01%

[0106] Silver nitrate AgNO ...

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Abstract

The invention provides a laminated slice type voltage-sensitive resistor and the manufacturing method of the voltage-sensitive resistor, which is suitable for electronic enterprises, the resistor comprises a lower cover, an upper cover, a voltage-sensitive resistor unit and a terminal electrode, wherein the voltage-sensitive resistor unit is arranged between the upper and the lower covers, the upper and the lower covers are made of ceramic protecting materials, the voltage-sensitive resistor unit is composed of an internal electrode, voltage-sensitive resistor film and ceramic protecting film, wherein the internal electrode and the voltage-sensitive resistor film are overprinted, the ceramic protecting film is overprinted on both sides of the overprinted internal electrode and the overprinted voltage-sensitive resistor film. The manufacturing method comprises the processes of batching, pulping, tape preparing, printing, hot-water voltage-sharing, slicing, dumping, sintering, end capping, electroplating and the like. The invention adopts the ceramic protecting materials and the method of overprinting the voltage-sensitive resistor film to form a homogenous, compact and moisture-proof protecting layer on the other four surfaces except both ends of the voltage-sensitive resistor, thereby the product can be easily electroplated with nickel and tin, and the reliability of the welding of the product is greatly improved.

Description

technical field [0001] The invention relates to a multilayer chip piezoresistor and a manufacturing method thereof. Background technique [0002] In the existing technology, the chip varistor is a new type of high-tech chip manufactured by using slurry film formation, lamination, pressure equalization, cutting, sintering, sealing, firing, electroplating and other chip processes. Type components are widely used in various mobile communication equipment, household appliances, medical equipment, automobiles and other fields. At present, most manufacturers at home and abroad adopt the "wet production process" of wet casting and lamination molding. In the manufacturing process, due to the wet forming is a single slurry forming at one time, coupled with the particularity of the varistor material, in the process of electroplating, the erosion of the material by the plating solution and the diffusion of electroplating will cause changes in the properties of the material, and the ob...

Claims

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Application Information

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IPC IPC(8): H01C7/10H01C7/112H01C1/02H01C17/00
Inventor 徐鹏飞高兴尧丁晓鸿樊应县肖倩
Owner SHENZHEN ZHENHUA FU ELECTRONICS
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