The invention provides a low-loss
microstrip transmission line based on substrate stacking and bonding. The low-loss
microstrip transmission line comprises an upper carrier plate layer, a hollow transmission layer, a lower carrier plate layer, a first bonding layer and a second bonding layer, a first
metal layer is arranged on the lower surface of the upper carrier plate layer, and a second
metal layer is arranged on the upper surface of the lower carrier plate layer; the first
metal layer, the second metal layer and the hollow-out area of the hollow-out transmission layer jointly form a transmission area; electromagnetic
waves are propagated in the transmission area in a quasi-TEM mode form; the upper carrier plate layer, the first bonding layer, the hollow transmission layer, the second bonding layer, the second metal layer and the lower carrier plate layer are stacked and bonded in parallel in sequence; and therefore, the interlayer is tightly bonded, the structure is flat and stable, and displacement and height change between the
layers are avoided. The invention has the advantages of low cost and low loss, and is suitable for the field of
microwave communication transmission. In addition, the antenna also has the characteristics of easy
processing, high integration and wide
frequency band, so that the antenna is widely applied to scenes using a multilayer board integration technology.