A method for through-hole reflow soldering

Abstract

The invention relates to a through-hole reflow soldering method. The method is characterized by printing solder at the plug-in hole positions where exposed pins can not meet the wave soldering requirement on a PCB (printed circuit board), inserting pins of a corresponding plug-in component into plug-in holes, the pins bringing part of solder paste in the plug-in hole walls and then carrying out reflow soldering. The method has the following advantages: temperature damage to the plug-in component is not easy to cause, the lack of space for manual repair soldering during manual repair solderingis avoided, cold soldering, poor soldering and other soldering defects are not easy to cause, the soldering quality is good, the reliability is high, and the soldering efficiency is high, and the method is suitable for soldering of the plug-in components with the exposed pins failing to meet the wave soldering requirement.

Description

Technical field [0001] The invention relates to a soldering method of plug-in components, in particular to a method for reflow soldering the through-holes of plug-in components on the PCB board when the size of the plug-in component pins does not match the thickness of the PCB board. Background technique [0002] Components, is the general term for components and devices. Existing plug-in components are usually welded by wave soldering. In order to achieve a good wave soldering effect, there are relatively strict requirements on the lead length of the plug-in components. The pin length refers to the size of the pin of the plug-in component that exceeds the reverse surface of the PCB after being inserted into the PCB board, and the pin length of about 0.8 mm to 1.5 mm must be met. When the lead length of the plug-in component does not meet the requirements, that is, less than 0.8 mm or no lead at all, manual repair welding is often used to weld the plug-in component. [0003] This...

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Problems solved by technology

[0003] This method has the following disadvantages: 1. During manual repair soldering, it often occurs that the temperature of the soldering iron for manual soldering is high (about 380 ° C), causing thermal damage to plug-in components; 2. The layout of the PCB board may lack space for manual repair soldering; 3. .Plug-in components do not come out of the pins or the pins are not enough, which cannot meet the requirements for the height of tin climbing and may easily cause defects such as cold soldering and virtual soldering; The welding quality of the feet is poor, and the welding strength cannot meet the requirements; 5. Manual repair welding has low efficiency and poor reliability; 6. When manual repair welding cannot be welded, re-selection is often required, which affects the realization of product functions

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