A method for through-hole reflow soldering
A reflow soldering and reflow soldering technology, which is applied in the direction of assembling printed circuits with electrical components, can solve the problems of thermal damage of plug-in components, insufficient tin penetration in holes, and insufficient tin penetration, so as to improve reliability and soldering quality and high reliability, simple and convenient operation
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- Publication Date
- 2011-12-21
Smart Images
Figure 1 Figure 2 Figure 3
Abstract
Description
Technical field
[0001] The invention relates to a soldering method of plug-in components, in particular to a method for reflow soldering the through-holes of plug-in components on the PCB board when the size of the plug-in component pins does not match the thickness of the PCB board. Background technique
[0002] Components, is the general term for components and devices. Existing plug-in components are usually welded by wave soldering. In order to achieve a good wave soldering effect, there are relatively strict requirements on the lead length of the plug-in components. The pin length refers to the size of the pin of the plug-in component that exceeds the reverse surface of the PCB after being inserted into the PCB board, and the pin length of about 0.8 mm to 1.5 mm must be met. When the lead length of the plug-in component does not meet the requirements, that is, less than 0.8 mm or no lead at all, manual repair welding is often used to weld the plug-in component.
[0003] This...
Examples
Embodiment Construction
[0018] The PCB board 3 is provided with an HDMI plug-in component 1 which is a patch connector with four pins 2. Among them, the length of pin 2 is 1.8 mm and 2.2 mm, and the thickness of PCB board 3 is 2.0 mm. After inserting this plug-in component 1 into the corresponding plug-in hole 4 on PCB board 3, pin 2 with a length of 1.8 mm is not The pin 2 with a length of 2.2 mm has a pin 2 of 0.2 mm, which does not meet the pin requirement of 0.8 mm to 1.5 mm, such as figure 1 Shown.
[0019] When using traditional methods, namely wave soldering and manual repair soldering, the front side cannot penetrate the tin, and the amount of solder filling in the plug-in hole 4 does not meet the 75% filling requirement of the plug-in hole 4 of IPC610D (Electronic Industry Solder Joint Inspection Standard). The reliability of the component is poor. At the same time, the plug-in hole 4 places tin piles, the surrounding large copper skin absorbs heat, and the solder joints are easy to cause cold ...