Multiple field sheet type piezoresistor and its producing method

Abstract

The invention relates to a multi-layer voltage-sensitive resistance and relative production, wherein it has the types as internal electrode and end electrode inside the insulated layer; the internal electrode and end electrode are connected directly; and the end electrode and the base board are directly connected; and the production comprises: preparing slurry, laminating layers, slicing, discharging adhesive, sintering, surface treating the insulated slurry of base board, producing two end electrodes and electrically plating. The invention insulated treats the surface of multi-layer sheet voltage-sensitive resistance without end electrodes, without water adsorption, and it plates nickel and tin on the surface of end electrode, to improve the welding property and the welding reliability, with lower cost and batch production.

Description

technical field

[0001] The invention relates to a piezoresistor, in particular to a multilayer chip piezoresistor and a manufacturing method thereof. Background technique

[0002] With the rapid development of electronic information systems, small chip varistors are widely used, which usually consist of a varistor substrate, internal electrodes inside the substrate, electrode paste on the surface of the substrate, glass materials or other materials. In the manufacturing process, the above-mentioned materials, structures and manufacturing processes all directly affect the performance of the product. At present, there is no structural standard for the surface material of chip varistors. A few multilayer chip varistors in the experimental stage use solderable solder paste to cover the surface of the terminal electrodes. They do not use tin plating, do not need electroplating, and have no paste on the non-terminal electrode parts. Material surface treatment, this kind of experi...

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