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3 results about "Maximum depth" patented technology

A method, apparatus, device, and medium for repairing defects of a pressure vessel

PendingCN122322815ADefect repairMaximum depth
This invention discloses a method, apparatus, equipment, and medium for repairing defects in pressure vessels. The defect repair method includes: acquiring the size and location information of a defect located on the flange sealing surface, the size information including the maximum depth of the defect, and the location information including a first radial distance between the maximum outline of the defect and the maximum outline of the sealing ring indentation, and a second radial distance between the maximum outline of the defect and the center circle of the sealing ring; determining the repair method for the defect based on the size and location information, the repair method including removing burrs, sharp edges, and protrusions, grinding to remove the defect, and grinding after welding repair; and repairing the defect according to the repair method. This invention first determines the repair method for the defect based on the size and location information, and then repairs the defect according to the repair method. That is, different repair methods are used for different defects, which helps to improve the feasibility of the repair method and the efficiency of defect repair.
Owner:SHANDONG NUCLEAR POWER CO LTD +1

Monitoring control method and system for trimming die, terminal and storage medium

The invention relates to a monitoring control method and system for a trimming die, a terminal and a storage medium, and relates to the field of die detection.The method comprises the steps that a contour curve is extracted from a working image; comparing the contour curve with a standard curve to obtain a contour deviation value; according to the smoothness of the contour curve, the cutting edge integrity of the trimming die is obtained; if the contour deviation value is larger than the first preset deviation or the cutting edge integrity is smaller than the second preset deviation, a sound-light alarm signal is generated; if the contour deviation value is not less than the first preset deviation and the cutting edge integrity is not less than the second preset deviation, establishing a three-dimensional model of the trimming die by using the working image; calculating the flatness of each surface of the three-dimensional model; judging whether a problem area exists in the three-dimensional model or not according to the flatness, wherein the maximum depth of the problem area is greater than a preset depth; if yes, generating a replacement alarm signal; and if not, the trimming die is used for the next round of machining. The method has the effect of improving the detection accuracy of the trimming die.
Owner:ZHEJIANG SOTE HEAVY IND TECH CO LTD

Detection method and device for evaluating adhesion properties of component and adhesive

The invention provides a detection method and a detection device for evaluating the bonding property of an element and adhesive glue. The method comprises the following steps: detecting the maximum bonding force value or the maximum strain value formed after the element is immersed in the adhesive glue based on a plurality of depth dimensions; determining a first depth size, wherein the ratio of the maximum bonding force value or the maximum strain value corresponding to the depth size greater than the first depth size to the bearing limit of the element is greater than or equal to a preset threshold value; a plurality of second depth dimensions are determined, the maximum bonding force value or the maximum strain value formed after the elements are immersed in the bonding glue is detected based on the second depth dimensions, and the second depth dimensions are larger than or equal to the first depth dimensions; and determining the maximum depth dimension, wherein the maximum adhesive force value or the maximum strain value corresponding to a second depth dimension smaller than or equal to the maximum depth dimension is smaller than the bearing limit of the element. According to the detection method, the maximum contact depth of the element and the adhesive is limited through the maximum depth size, so that the element is prevented from being damaged by the adhesive.
Owner:HUAWEI TECH CO LTD