5 results about "Maximum depth" patented technology

The invention is notably directed to a computer-implemented method of controlling a bucket (110) of an excavator (1) for autonomous excavation, wherein the method comprises accessing (S5) a specification of a shape to be excavated in a terrain (150), and executing (S30) a control policy (206) including a constraint generator (2061) and a control model (2062) trained with reinforcement learning (preferably in simulation), for the control policy (206) to repeatedly perform (S30) algorithmic cycles. Each cycle of the algorithmic cycles comprises: updating (S32, S33) a state of the bucket (110) and a perception of the terrain (150) based on signals received from a set of sensors (410, 430), which preferably are on board the excavator (1); based on the accessed specification, the updated state of the bucket (110), and the updated perception, generating (S34) one or more maximum-depth constraints (164) through the constraint generator (2061), and inferring (S35), through the control model (2062), control data meeting the one or more maximum-depth constraints (164) generated; and instructing (S38) to control the bucket (110) based on actuator control signals formed (S36) according to the control data inferred, to excavate (S40) the terrain (150) in accordance with said specification. The invention is further directed to related systems and computer program products.

This invention discloses a method, apparatus, equipment, and medium for repairing defects in pressure vessels. The defect repair method includes: acquiring the size and location information of a defect located on the flange sealing surface, the size information including the maximum depth of the defect, and the location information including a first radial distance between the maximum outline of the defect and the maximum outline of the sealing ring indentation, and a second radial distance between the maximum outline of the defect and the center circle of the sealing ring; determining the repair method for the defect based on the size and location information, the repair method including removing burrs, sharp edges, and protrusions, grinding to remove the defect, and grinding after welding repair; and repairing the defect according to the repair method. This invention first determines the repair method for the defect based on the size and location information, and then repairs the defect according to the repair method. That is, different repair methods are used for different defects, which helps to improve the feasibility of the repair method and the efficiency of defect repair.

The invention relates to a monitoring control method and system for a trimming die, a terminal and a storage medium, and relates to the field of die detection.The method comprises the steps that a contour curve is extracted from a working image; comparing the contour curve with a standard curve to obtain a contour deviation value; according to the smoothness of the contour curve, the cutting edge integrity of the trimming die is obtained; if the contour deviation value is larger than the first preset deviation or the cutting edge integrity is smaller than the second preset deviation, a sound-light alarm signal is generated; if the contour deviation value is not less than the first preset deviation and the cutting edge integrity is not less than the second preset deviation, establishing a three-dimensional model of the trimming die by using the working image; calculating the flatness of each surface of the three-dimensional model; judging whether a problem area exists in the three-dimensional model or not according to the flatness, wherein the maximum depth of the problem area is greater than a preset depth; if yes, generating a replacement alarm signal; and if not, the trimming die is used for the next round of machining. The method has the effect of improving the detection accuracy of the trimming die.

The invention discloses a wafer chamfering method which comprises the following steps: determining an edge defect of a wafer to be chamfered, and obtaining the maximum depth h of the edge defect in the radial direction of the wafer to be chamfered; establishing a coordinate system which takes the preset positioning notch on the wafer to be chamfered facing the preset direction as a reference position, taking the preset direction as a Y axis, taking a direction perpendicular to the preset direction as an X axis, and obtaining an included angle theta between the maximum depth direction of the edge defect and the Y axis; respectively acquiring a first component of the maximum depth h in the X-axis direction and a second component of the maximum depth h in the Y-axis direction according to the included angle theta; according to the first component and the second component, the relative position of the to-be-chamfered wafer and the machining carrying table is adjusted, so that the circle center of the to-be-chamfered wafer deviates towards the edge defect relative to the rotating center of the machining carrying table; and the to-be-chamfered wafer is ground through the grinding wheel mechanism, the removal amount of the side, close to the edge defect, of the to-be-chamfered wafer is larger than the removal amount of the side, away from the edge defect, of the to-be-chamfered wafer, and the chamfered wafer is obtained.

The invention provides a detection method and a detection device for evaluating the bonding property of an element and adhesive glue. The method comprises the following steps: detecting the maximum bonding force value or the maximum strain value formed after the element is immersed in the adhesive glue based on a plurality of depth dimensions; determining a first depth size, wherein the ratio of the maximum bonding force value or the maximum strain value corresponding to the depth size greater than the first depth size to the bearing limit of the element is greater than or equal to a preset threshold value; a plurality of second depth dimensions are determined, the maximum bonding force value or the maximum strain value formed after the elements are immersed in the bonding glue is detected based on the second depth dimensions, and the second depth dimensions are larger than or equal to the first depth dimensions; and determining the maximum depth dimension, wherein the maximum adhesive force value or the maximum strain value corresponding to a second depth dimension smaller than or equal to the maximum depth dimension is smaller than the bearing limit of the element. According to the detection method, the maximum contact depth of the element and the adhesive is limited through the maximum depth size, so that the element is prevented from being damaged by the adhesive.