Preparation method of dielectric cloth for preparing copper-clad plate

A technology of dielectric cloth and copper clad laminate, which is applied in the field of preparation of dielectric cloth for copper clad laminate, which can solve the problems of low peel strength, high loss factor, and small surface insulation resistance

Active Publication Date: 2011-07-06
广德东风电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0004] However, the copper clad laminates in the prior art have high dielectric loss factor, small surface insulation resistance, low bending strength, and low peel strength.

Method used

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  • Preparation method of dielectric cloth for preparing copper-clad plate

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Embodiment 1

[0019] A preparation method for preparing dielectric cloth for copper clad laminate, including the following steps:

[0020] a. Heat the glass fiber cloth at 410°C for 2 minutes, soak it in distilled water for 13 seconds, and dry it through a five-stage heating tunnel (see Table 2) at 60°C to 250°C;

[0021] b. Weigh the concentrated dispersion of perfluoroalkoxy and distilled water according to the mass ratio of 1:1, put them in a stirrer, stir at 200r / min for 30 minutes, filter with EW60 glass fiber cloth to obtain impregnating liquid I; Concentrated dispersion liquid than perfluoroalkoxy: polytetrafluoroethylene concentrated dispersion liquid: distilled water=1:8:2 After weighing each substance, put a small amount of nonylphenol polyoxyethylene ether into the mixer, and add 200r Stir for 30-90 minutes at a rotation speed of / min, and filter with EW60 glass fiber cloth to obtain immersion liquid II;

[0022] c. Dip the glass fiber cloth treated in step a for 20-40 seconds in the d...

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PUM

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Abstract

The invention discloses a preparation method of dielectric cloth for preparing copper-clad plate. The method comprises the following steps of: a, performing heat treatment and drying on a glass fiber fabric; b, preparing two kinds of impregnation liquid, namely impregnation liquid I and impregnation liquid II; c, impregnating the glass fiber fabric treated in the step a in the impregnation liquid I, and drying in a drying tunnel with the temperature of between 60 and 250 DEG C; d, impregnating the glass fiber fabric treated in the step c in the impregnation liquid II and drying in the drying tunnel with the temperature of between 60 and 250 DEG C; and e, solidifying the glass fiber fabric obtained in the step d in a three-section temperature rise drying channel with the temperature of between 350 and 400 DEG C to obtain the dielectric cloth. The dielectric loss factor of the copper-clad plate prepared from the dielectric cloth is reduced from 1*10<-3> to 7*10<-4>, the surface insulation resistance is improved from 1*10<10> to mean 10<15>, the bending strength is improved from 80MPa to mean 140MPa, and the peeling strength is improved from 1.5kN/m to mean 3.5kN/m.

Description

Technical field [0001] The invention relates to a dielectric cloth for copper clad laminates, in particular to a preparation method for preparing a dielectric cloth for copper clad laminates. Background technique [0002] Printed circuit boards are widely used in computers, communications, instrumentation, military industry, automobiles, scientific equipment and other fields to provide identification and graphics for component insertion, welding, inspection and maintenance. The substrate of the printed circuit board is also called copper clad laminate. With the gradual development of communications and electronic products towards high speed and high frequency, the market demand for high frequency and high performance PTFE copper clad laminates has also grown rapidly. [0003] Polytetrafluoroethylene copper clad laminate is made of glass fiber cloth through a series of treatments to obtain dielectric cloth, and then combine the dielectric cloth and copper foil, so the preparation o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05C3/02B05D7/24
Inventor 沈海平禹胜林马立萍
Owner 广德东风电子有限公司
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