Preparation method of platinized copper powder lead-free soldering paste

A lead-free solder, platinum copper technology, applied in welding equipment, welding media, manufacturing tools, etc., can solve the problems of low surface insulation resistance, shortened template life, easy to produce solder balls, etc., and achieve high surface insulation resistance and low cost. , the effect of prolonging the service life

Inactive Publication Date: 2016-07-13
袁春华
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention: In order to reduce the cost, use high-silver lead-free solder paste to prepare low-silver solder paste, so that its activity is insufficient, solder balls are easily generated, the surface insulation resistance is low, and the life of the template is shortened. It is easy to mix and stir the deoxidized copper powder and tin chloride, centrifuge, wash and dry the lower precipitate to obtain activated copper powder, then mix it with absolute ethanol and other substances, and add platinum nitrate solution dropwise to it , centrifuge, wash the lower precipitate, dry to obtain platinum-loaded copper powder, and set aside, then mix and heat rosin and ammonium cholate to prepare flux, set aside, then mix platinum-loaded copper powder with tin powder, and press it into a billet. Heating, cooling, ball milling and sieving, mixing with platinum-loaded copper powder, and calcining, the method of preparing lead-free solder paste

Method used

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Examples

Experimental program
Comparison scheme
Effect test

example 1

[0019] First, according to the mass ratio of 1:5, the copper powder was stirred and mixed with the mass concentration of 5% sulfuric acid solution and placed in a beaker, ultrasonically dispersed at 300W for 15min, and then left to age for 10h, filtered and collected filter cake, at 80 Dry at ℃ for 8 hours to prepare the deoxidized copper powder; then according to the mass ratio of 1:5, stir and mix the deoxidized copper powder prepared above with the mass concentration of 10% tin chloride solution and place it in a beaker, at 1800r / min for 15 min, then collect the lower precipitate, wash 5 times with deionized water, and dry at 80°C for 8 h to prepare activated copper powder; then weigh 55 parts of polyvinyl alcohol and 10 parts of the above-mentioned The prepared activated copper powder and 35 parts of absolute ethanol were placed in a three-necked flask, magnetically stirred at 1600r / min for 15min, and then 0.8mol / L platinum nitrate solution was added dropwise to it, and th...

example 2

[0021]First, according to the mass ratio of 1:5, the copper powder was stirred and mixed with the mass concentration of 5% sulfuric acid solution and placed in a beaker, ultrasonically dispersed at 200W for 10min, and then left to age for 8h, filtered and collected filter cake, at 65 Dry at ℃ for 6 hours to prepare the deoxidized copper powder; then according to the mass ratio of 1:5, stir and mix the deoxidized copper powder prepared above with a mass concentration of 10% tin chloride solution and place it in a beaker, and heat it at 1500r / min for 10 min, then collect the lower precipitate, wash with deionized water three times, and dry at 65°C for 6 h to prepare activated copper powder; then weigh 45 parts of polyvinyl alcohol and 15 parts of the above-mentioned The prepared activated copper powder and 40 parts of absolute ethanol were placed in a three-necked flask, magnetically stirred at 1350r / min for 10min, and then 0.8mol / L platinum nitrate solution was added dropwise t...

example 3

[0024] First, according to the mass ratio of 1:5, the copper powder and the mass concentration of 5% sulfuric acid solution were stirred and mixed and placed in a beaker, ultrasonically dispersed at 250W for 12min, and then left to age for 9h, filtered and collected filter cake, at 70 Dry at ℃ for 7 hours to prepare the de-oxidized copper powder; then according to the mass ratio of 1:5, mix the de-oxidized copper powder prepared above with a mass concentration of 10% tin chloride solution and put it in a beaker, and heat it at 1700r / Centrifuge at 1 min for 12 min, then collect the lower precipitate, wash 4 times with deionized water, and dry at 70°C for 7 h to prepare activated copper powder; then weigh 50 parts of polyvinyl alcohol, 10 parts of the above-mentioned The prepared activated copper powder and 40 parts of absolute ethanol were placed in a three-necked flask, magnetically stirred at 1500r / min for 12min, and then 0.8mol / L platinum nitrate solution was added dropwise ...

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PUM

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Abstract

The invention relates to a preparation method of a platinized copper powder lead-free soldering paste, and belongs to the technical field of material preparation.The method comprises the steps that copper powder with no oxide layer and a stannic chloride solution are mixed and stirred, the mixture is centrifuged, lower-layer precipitation is washed and dried to obtain activated copper powder, the activated copper powder and matter such as absolute ethyl alcohol are mixed and stirred, a platinum nitrate solution is dropwise added into the mixture, centrifugation is carried out, lower-layer precipitation is washed and dried to obtain platinized copper powder for use, rosin and matter such as ammonium cholate are mixed and heated to prepare scaling powder for use, the platinized copper powder and tin powder are mixed, the mixture is pressed into a blank, the blank is heated, cooled, subjected to ball milling and screened and then is mixed with the platinized copper powder and calcined, and therefore the lead-free soldering paste can be prepared.The surface insulation resistance of the prepared lead-free soldering paste is high and reaches 95*108-105*108 Ohm; by using the platinized copper powder lead-free soldering paste, the service life of a template is prolonged and can reach up to 9h.

Description

technical field [0001] The invention relates to a method for preparing platinum-loaded copper powder lead-free solder paste, which belongs to the technical field of material preparation. Background technique [0002] Solder paste is also called solder paste, the English name is solderpaste, gray paste, solder paste is a new type of soldering material that emerged with SMT, it is made of solder powder, flux and other surfactants, thixotropic agents, etc. Blend to form a paste mixture. It is mainly used for soldering electronic components such as PCB surface resistance, capacitor and IC in SMT industry. [0003] The mainstream alloy for lead-free solder paste is Sn99.6Ag3Cu0.5 series, the weight ratio of Ag is high, and Ag is a precious metal with scarce reserves. In recent years, the price of Ag futures in the international market has continued to rise, and the cost of Ag is in the It accounts for 40% to 50% of the lead-free solder, which greatly increases the raw material ...

Claims

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Application Information

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IPC IPC(8): B23K35/40B23K35/26
CPCB23K35/40B23K35/262
Inventor 袁春华薛培龙高玉刚
Owner 袁春华
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