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Welding flux agent of solder with no lead and free from cleaning

A lead-free solder and flux technology, applied in the direction of welding/cutting medium/material, welding medium, welding equipment, etc., to achieve excellent solderability, improve soldering performance, and reasonable preparation

Active Publication Date: 2006-12-20
深圳市唯特偶新材料股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The object of the present invention is to aim at the inapplicability of the existing lead-containing solder flux to lead-free solder, and to provide a no-clean lead-free solder flux that can be used effectively with lead-free solder. The present invention considers environmental protection requirements, and the solvent of the flux can be used Deionized water instead of VOC solvents

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] Embodiment 1: This is a no-clean lead-free solder flux whose solvent is isopropanol, and its weight ratio is composed of:

[0030] Hydrogenated rosin 3.50

[0031] Succinic acid 0.80

[0032] Adipic acid 0.80

[0033] Sebacic acid 0.40

[0034] Hydrogenated rosin ethyl ester 0.50

[0035] Diethyl adipate 0.30

[0036] DBE (mixed esters) 0.80

[0037] Diethylene glycol 0.50

[0038] Propylene glycol monomethyl ether 2.50

[0039] FSC0.08

[0040] OP-10 0.20

[0041] Isopropanol 89.62

[0042] The hydrogenated rosin ethyl ester belongs to modified rosin resin.

[0043] Preparation method: at room temperature, add isopropanol into a clean enamel kettle with stirring, start stirring, first add insoluble raw materials, after stirring for half an hour, add other raw materials in turn, continue stirring until all solid substances are dissolved, mix ...

Embodiment 2

[0044] Embodiment 2: This is a no-clean lead-free solder flux whose solvent is isopropanol and deionized water, and its weight ratio consists of:

[0045] Water-soluble Rosin Tree Fat 3.2

[0046] Succinic acid 0.8

[0047] Adipic acid 1.2

[0048] Dibromosuccinic acid 0.4

[0049] Triethylamine 1.2

[0050] DBE (mixed esters) 1.5

[0051] FC-135 0.1

[0052] TX-10 0.3

[0053] Diethylene glycol monomethyl ether 2.5

[0054] Ethylene glycol butyl ether 3.0

[0055] Butyl acetate 3.0

[0056] Isopropanol 32.8

[0057] Deionized water 50.0

[0058] Preparation method: at room temperature, add isopropanol and deionized water into a clean enamel kettle with stirring, start stirring, first add insoluble raw materials, after stirring for half an hour, add other raw materials in turn, continue stirring until all solid substances are dissolved, Mix evenly, stop stirring, let stand and filter to get the product.

Embodiment 3

[0059] Embodiment 3: This is a no-clean lead-free solder flux whose solvent is deionized water, and its weight ratio consists of:

[0060] Water soluble rosin resin 1.0

[0061] Succinic acid 0.8

[0062] Adipic acid 1.2

[0063] Dibromosuccinic acid 0.2

[0064] Dibromobutenediol 0.3

[0065] Benzoic acid 2.0

[0066] OP-10 0.3

[0067] FSC0.1

[0068] DEB (blended fat) 3.0

[0069] Ethylene glycol butyl ether 5.0

[0070] Benzotriazole 0.2

[0071] Deionized water 85.9

[0072] Preparation method: at room temperature, add deionized water into a clean enamel kettle with stirring, start stirring, first add insoluble raw materials, after stirring for half an hour, add other raw materials in turn, continue stirring until all solid substances are melted, mix evenly, Stop stirring, let it stand and filter to obtain the product.

[0073] The no-cleaning lead-free solder flux that above embodiment is made, checks by Japanese standard JIS-Z-3197-1999, and...

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Abstract

A non-lead solder flux without cleaning contains organic acid as activating agent, improved resin, surfactant, high-boiling-point solvent, wetting agent and isopropanol or deionized water instead of VOC solvent.

Description

technical field [0001] The invention relates to flux, which is a no-cleaning lead-free solder flux. technical background [0002] At present, the flux used is suitable for lead-containing solder, and its activity, wettability and temperature resistance are all developed according to the performance of lead-containing solder. The most obvious performance difference between lead-free solder and lead-containing solder is that the lead-free solder itself has poor wetting ability and the soldering temperature used is high. Therefore, fluxes suitable for lead-containing solders are not suitable for lead-free solders. First, this type of flux does not have enough ability to help lead-free solders wet, and second, it is not suitable for the high soldering temperature of lead-free solders. Lead solder fluxes are corrosive to lead-free solder alloys. In addition, the emission of volatile organic compounds (VOC) has a destructive effect on the surface ozone, and is a substance that i...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/363B23K35/362
Inventor 张鸣玲廖高兵
Owner 深圳市唯特偶新材料股份有限公司
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