Welding-aiding agent for circuit board welding and preparation method thereof

A flux and circuit board technology, applied in welding equipment, welding medium, welding/cutting medium/material, etc., can solve the problems of high residue and low cost, and achieve less residue, good dryness, and low ionic pollution. Effect

Active Publication Date: 2017-10-20
盐城市贝加尔电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the soldering process of electronic products, rosin resin flux mainly composed of rosin, resin, halide-containing active agent, additive and organic solvent is generally used. Although this type of flux has good solderability and low cost , but high post-soldering residue

Method used

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  • Welding-aiding agent for circuit board welding and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] A flux used for circuit board welding, comprising the following components in parts by weight: 20 parts of cerium oxide, 2 parts of oxalic acid, 3 parts of butyl acetate, 1 part of corundum powder, 1 part of fluorocarbon sub-surfactant, 2 parts of potassium carbonate, 2 parts of sodium carbonate, 5 parts of hydroxy organic acid, 3 parts of formate ester, 2 parts of alcohol amine, 3 parts of glyceryl monostearate, 0.5 part of polyisobutylene succinimide, antioxidant 3 copies.

[0021] The hydroxy organic acid is two or more of water-soluble citric acid, DL-malic acid, tartaric acid, glycolic acid; the alcohol amine is one of triethanolamine, triisopropanolamine or their composition.

[0022] The purity of the cerium oxide is greater than 99.0%.

[0023] Described antioxidant is 2,6-di-tert-butyl p-cresol, hydroquinone, 2-tert-butyl hydroquinone, 2-tert-butyl-4-methoxyphenol and 3-tert-butyl One or more of butyl-4-methoxyphenol.

[0024] A preparation method for solde...

Embodiment 2

[0032] A soldering flux for circuit board welding, comprising the following components in parts by weight: 25 parts of cerium oxide, 6 parts of oxalic acid, 5 parts of butyl acetate, 2 parts of corundum powder, 3 parts of fluorocarbon sub-surfactant, 9 parts of potassium carbonate, 8 parts of sodium carbonate, 12 parts of hydroxy organic acid, 6 parts of formate ester, 6 parts of alcohol amine, 6 parts of glyceryl monostearate, 1.5 parts of polyisobutylene succinimide, antioxidant 7 servings.

[0033] The hydroxy organic acid is two or more of water-soluble citric acid, DL-malic acid, tartaric acid, glycolic acid; the alcohol amine is one of triethanolamine, triisopropanolamine or their composition.

[0034] The purity of the cerium oxide is greater than 99.0%.

[0035] Described antioxidant is 2,6-di-tert-butyl p-cresol, hydroquinone, 2-tert-butyl hydroquinone, 2-tert-butyl-4-methoxyphenol and 3-tert-butyl One or more of butyl-4-methoxyphenol.

[0036] A preparation metho...

Embodiment 3

[0044] A soldering flux for circuit board welding, comprising the following components in parts by weight: 30 parts of cerium oxide, 10 parts of oxalic acid, 8 parts of butyl acetate, 3 parts of corundum powder, 5 parts of fluorocarbon sub-surfactant, 15 parts of potassium carbonate, 12 parts of sodium carbonate, 18 parts of hydroxy organic acid, 9 parts of formate ester, 10 parts of alcohol amine, 9 parts of glyceryl monostearate, 2.5 parts of polyisobutylene succinimide, antioxidant 10 servings.

[0045] The hydroxy organic acid is two or more of water-soluble citric acid, DL-malic acid, tartaric acid, glycolic acid; the alcohol amine is one of triethanolamine, triisopropanolamine or their composition.

[0046] The purity of the cerium oxide is greater than 99.0%.

[0047] Described antioxidant is 2,6-di-tert-butyl p-cresol, hydroquinone, 2-tert-butyl hydroquinone, 2-tert-butyl-4-methoxyphenol and 3-tert-butyl One or more of butyl-4-methoxyphenol.

[0048] A preparation ...

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PUM

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Abstract

The invention discloses a welding-aiding agent for circuit board welding. The welding-aiding agent comprises the following components of, by weight, 20-30 parts of cerium oxide, 2-10 parts of oxalic acid, 3-8 parts of butyl acetate, 1-3 parts of alundum powder, 1-5 parts of a fluorocarbon surfactant, 2-15 parts of potassium carbonate, 2-12 parts of sodium carbonate, 5-18 parts of hydroxy organic acid, 3-9 parts of formic-acid-rich ester, 2-10 parts of alkylol amine, 3-9 parts of glycerin monostearate, 0.5-2.5 parts of pib succinimide and 3-10 parts of antioxygen. The manner that the hydroxy organic acid which is high in activity, less in residue and low in corrosion and the alkylol amine are compounded into an active substance compound assisted by and matched with a fluorocarbon surfactant, the antioxygen and glycerin monostearate and the like is adopted, the environmentally-friendly welding-aiding agent for circuit board welding is prepared, the welding-aiding agent is low in residue, small in corrosion, liable to be washed and free of lead and halogen, and the welding-aiding agent has good suitability, inoxidizability, rheological property and stability with lead-free tin welding micro powder.

Description

technical field [0001] The invention belongs to the technical field of welding, and in particular relates to a flux used for circuit board welding and a preparation method thereof. Background technique [0002] In the soldering process of electronic products, rosin resin flux mainly composed of rosin, resin, halide-containing active agent, additive and organic solvent is generally used. Although this type of flux has good solderability and low cost , but the residue after welding is high. Its residues contain halogen ions, which will gradually cause problems such as electrical insulation performance decline and short circuit. To solve this problem, it is necessary to clean the rosin resin-based flux residues on the electronic printed board, and clean the rosin resin-based flux residues. The cleaning agent used is mainly fluorine and chlorine compounds. This compound is a depleting substance of the atmospheric ozone layer. Moreover, it is also required to be clean and non-c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/363B23K35/40
CPCB23K35/3602B23K35/3612B23K35/3613B23K35/3615B23K35/3618B23K35/40
Inventor 殷世尧
Owner 盐城市贝加尔电子材料有限公司
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