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Low-VOC (volatile organic compound) non-cleaning flux comprising complex surfactant and method for preparing same

A surfactant and flux technology, used in welding equipment, welding media, manufacturing tools, etc., can solve hidden dangers, safety, environmental pollution and other problems of no-clean flux, and achieve reduced surface tension, low solid content, and environmental protection. friendly effect

Inactive Publication Date: 2012-10-03
GUANGDONG UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, most of the no-clean fluxes currently used in the surface mount technology (SMT) industry are solvent-based no-clean fluxes that have potential safety hazards and are likely to cause environmental pollution.

Method used

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  • Low-VOC (volatile organic compound) non-cleaning flux comprising complex surfactant and method for preparing same
  • Low-VOC (volatile organic compound) non-cleaning flux comprising complex surfactant and method for preparing same
  • Low-VOC (volatile organic compound) non-cleaning flux comprising complex surfactant and method for preparing same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Add 0.5% succinic acid and 0.5% dl-malic acid, 1% isopropanol, 1% ethylene glycol, 1% ethylene glycol butyl ether, 0.5% polyvinyl alcohol, and 0.01% corrosion inhibitor to the reaction vessel in sequence , LA300SB 0.05% and CO-977 0.05%, the balance of self-distilled deionized water; after adding each component, stir at 85°C-95°C until completely dissolved, and filter the mixture to obtain flux after mixing evenly.

Embodiment 2

[0032] Add 1.25% of glutaric acid and 1.25% of dl-malic acid, 1% of isopropanol, 1% of ethylene glycol and 1% of butyl glycol ether, 0.1% of polyvinylpyrrolidone, and 0.03% of corrosion inhibitor in the reaction vessel , CO-436 0.25% and CO-630 0.25%, and the balance of self-distilled deionized water; after adding each component, stir at room temperature until completely dissolved, and filter the mixture to obtain flux after mixing evenly.

Embodiment 3

[0034] Add 0.6% of itaconic acid and 0.6% of dl-malic acid, 1% of isopropanol, 1% of ethylene glycol, 1% of butyl glycol ether, 1% of glycerol, and 0.04% of corrosion inhibitor in the reaction vessel , FT900 0.25% and LA300SB 0.25%, the balance of self-distilled deionized water; after adding each component, stir at room temperature until completely dissolved, and filter the mixture to obtain flux after mixing evenly.

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PUM

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Abstract

The invention discloses a low-VOC (volatile organic compound) non-cleaning flux comprising a complex surfactant and a method for preparing the flux. The flux can be coated on the welding surface of printed circuit boards in a spraying and dip way, is applicable to the lead-free welding process and mainly comprises deionized water, a complex activating agent, a complex surfactant, a complex co-solvent, a film-forming agent and a corrosion inhibitor. The flux contains less than 4.5% of VOC and less than 2.5% of solid, is environmentally friendly, free from cleaning, nonflammable and not easy to burn, has high insulation resistance and is convenient to store and transport. The process for preparing the flux is simple and suitable for the preparation of a large amount of flux and the industrial production, and the raw materials for preparing the flux are easy to obtain and low in cost.

Description

technical field [0001] The invention relates to a low-VOC no-cleaning flux containing a compound surfactant and a preparation method thereof, which is suitable for a halogen-free, low-volatile organic compound (VOC) special for lead-free solder on the welding surface of a printed circuit board (PCB). ), low solids, film-forming, water-based no-clean flux with formulated surfactants. Background technique [0002] With the development of green chemistry, water-based no-clean flux for lead-free solder has important application value in the future electronics industry. Sn-0.7Cu and Sn-3.0Ag-0.5Cu are two lead-free solders commonly used in electronic packaging at present. Sn-0.7Cu solder is cheap, has high ductility and creep strength, low resistance, and less holes on the surface of the soldering part when it is slowly cooled. It is a good cycle product and can be used for wave soldering and dip soldering. Sn-3.0Ag-0.5Cu solder has high shear strength, toughness and high tempe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/363
Inventor 郝志峰吴青青钟金春余坚孙明陈奕向饶耀
Owner GUANGDONG UNIV OF TECH
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