Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Soldering paste and soldering flux thereof, and preparation methods thereof

A technology of flux and solder paste, used in manufacturing tools, welding media, welding equipment, etc., can solve problems such as failure to pass the probe test and difficulty in solder paste, and achieve the effect of improving the pass rate of the probe test and improving the welding performance.

Active Publication Date: 2011-09-14
DONGGUAN YONGAN TECH
View PDF7 Cites 18 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of this, the present invention aims at the deficiencies in the prior art, and its main purpose is to provide a solder paste and its flux and their manufacturing method, which can effectively solve the problem that the existing solder paste is difficult or even impossible to pass the probe test. question

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Soldering paste and soldering flux thereof, and preparation methods thereof
  • Soldering paste and soldering flux thereof, and preparation methods thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0056] First, weigh 15 parts by weight of hydrogenated rosin, 29 parts by weight of diethylene glycol dibutyl ether, 6 parts by weight of 2-ethyl (-1,3-) hexanediol, and 15 parts by weight of hydrogenated castor oil into a stainless steel container Internal heating to 130°C ~ 150°C, and stirring until completely melted. Next, the temperature of the stainless steel container was lowered to 110° C. to 130° C., and then 7 parts by weight of succinic acid and 3 parts by weight of glutaric acid were added into the stainless steel container and stirred until completely melted. Next, the temperature of the stainless steel container was further lowered to 70°C to 90°C, and then 10 parts by weight of methylimidazole and 15 parts by weight of polyisobutylene 800 were added into the stainless steel container, stirred until completely melted, and then cooled to prepare flux. Finally, fully stir and mix the lead-free solder powder and flux in a vacuum mixer to obtain a solder paste.

Embodiment 2

[0058]First, 21 parts by weight of hydrogenated rosin, 30 parts by weight of diethylene glycol dibutyl ether, 14 parts by weight of 2-ethyl (-1,3-) hexanediol, 3 parts by weight of hydrogenated castor oil, 2 parts by weight of stearin The acid amide is weighed and placed in a stainless steel container, heated to 130°C to 150°C, and stirred until completely melted. Next, the temperature of the stainless steel container was lowered to 110° C. to 130° C., and then 5 parts by weight of succinic acid and 6 parts by weight of glutaric acid were added into the stainless steel container and stirred until completely melted. Next, the temperature of the stainless steel container was further lowered to 70°C to 90°C, and then 9 parts by weight of methylimidazole and 10 parts by weight of polyisobutylene 3000 were added into the stainless steel container, stirred until completely melted, and then cooled to prepare flux. Finally, fully stir and mix the lead-free solder powder and flux in a ...

Embodiment 3

[0060] First, 27 parts by weight of hydrogenated rosin, 24 parts by weight of diethylene glycol dibutyl ether, 20 parts by weight of 2-ethyl (-1,3-) hexanediol, 5 parts by weight of hydrogenated castor oil, 3 parts by weight of stearin The acid amide is weighed and placed in a stainless steel container, heated to 130°C to 150°C, and stirred until completely melted. Next, the temperature of the stainless steel container was lowered to 110° C. to 130° C., and then 6 parts by weight of succinic acid and 1 part by weight of glutaric acid were added into the stainless steel container and stirred until completely melted. Next, the temperature of the stainless steel container was further lowered to 70°C to 90°C, and then 8 parts by weight of methylimidazole and 6 parts by weight of polyisobutylene 4500 were added into the stainless steel container, stirred until completely melted, and then cooled to prepare flux. Finally, fully stir and mix the lead-free solder powder and flux in a v...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
boiling pointaaaaaaaaaa
Login to View More

Abstract

The invention discloses soldering paste and a soldering flux thereof, and preparation methods thereof. The soldering paste comprises lead-free soldering powder and the soldering flux, wherein the soldering flux comprises the following raw materials in percentage by weight: 6-15 percent of polyisobutene or polybutylene, 3-10 percent of imidazoles compound, 15-45 percent of rosin, 3-15 percent of thixotropic agent, 3-15 percent of active agent and the balance of solvent; therefore, through adding at least one of polyisobutene or polybutylene and replacing partial rosin with the polyisobutene orpolybutylene, on the one hand, the consumption of the rosin can be reduced so that yellow rosin residuals are reduced, on the other hand, the polyisobutene or polybutylene residuals are both colorless and transparent viscous fluid and can soften the harder rosin residuals so that soldering paste residuals are soft, colorless and transparent substances, therefore, the probe test passing rate is greatly improved, and an effective guarantee is provided for the welding quality of electronic products.

Description

technical field [0001] The invention relates to the technology in the field of solder, in particular to a solder paste and its flux as well as their manufacturing method. Background technique [0002] Solder paste is widely used in high-precision electronic components. Using solder paste, on the one hand, can isolate electronic components from air to prevent oxidation. On the other hand, using solder paste has strong welding performance, high resistance, and prevents virtual soldering from occurring. to great effect. [0003] At present, with the rapid development of science and technology, people have higher and higher requirements for the welding quality of electronic products. Therefore, more and more electronic products use probe testing to detect their welding performance after welding. But the solder paste of existing patent has the following defects: [0004] Solder paste has a lot of rosin residues covering the solder joints after use, and the residues are hard. ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/363B23K35/40
Inventor 吴国齐宣英男
Owner DONGGUAN YONGAN TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com