Tin-silver-copper composite solder paste enhanced by titanium dioxide nanoparticles and preparation method thereof

A nanoparticle and titanium dioxide technology, applied in welding equipment, welding media, manufacturing tools, etc., can solve the problems that cannot meet the reliability requirements of tiny solder joints, and achieve the effects of improving mechanical properties, refining grains, and inhibiting growth

Inactive Publication Date: 2015-11-18
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Studies have shown that doping the existing Sn-Ag-Cu and other solder alloys with an appropriate amount of micron-scale and nano-scale particles can enhance the wettability and mechanical properties of the solder, but the developed composite solder still cannot meet the reliability requirements of tiny solder joints. requirements, especially to effectively inhibit the growth of IMC at the interface of micro-solder joints to improve the reliability of micro-solder joints

Method used

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  • Tin-silver-copper composite solder paste enhanced by titanium dioxide nanoparticles and preparation method thereof
  • Tin-silver-copper composite solder paste enhanced by titanium dioxide nanoparticles and preparation method thereof
  • Tin-silver-copper composite solder paste enhanced by titanium dioxide nanoparticles and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] Add nano-titanium dioxide powder (particle size 5-25nm) with a mass fraction of 0.02% to tin-silver-copper lead-free solder paste with a mass ratio of 96.5:3:0.5, and mechanically stir for more than 45 minutes to ensure that the titanium dioxide nanoparticles are uniform Distributed in tin-silver-copper lead-free solder paste, titanium dioxide nanoparticle-enhanced tin-silver-copper composite solder paste can be obtained.

[0023] The scanning electron micrographs of the tin-silver-copper lead-free solder paste without adding nano-titanium dioxide powder and the composite solder paste obtained in this embodiment after reflowing for 60 seconds are as follows: figure 1 and 2 shown. From figure 1 It can be seen that the gray matrix is ​​the tin-rich phase β-Sn, and the white needle-like particles are the intermetallic compound Ag 3 Sn grains, the average size of the grains is 0.52±0.07μm, and the average spacing between the grains is 0.65±0.06μm; from figure 2 It can ...

Embodiment 2

[0025] Add nano-titanium dioxide powder (particle size 5-25nm) with a mass fraction of 0.05% to tin-silver-copper lead-free solder paste with a mass ratio of 96.5:3:0.5, and mechanically stir for more than 45 minutes to ensure that the titanium dioxide nanoparticles are uniform Distributed in tin-silver-copper lead-free solder paste, titanium dioxide nanoparticle-enhanced tin-silver-copper composite solder paste can be obtained.

[0026] The scanning electron microscope image of the composite solder paste obtained in this embodiment after reflow for 60s is as follows image 3 As shown, the gray matrix is ​​the tin-rich phase β-Sn, and the white particles are the intermetallic compound Ag 3 The average grain size of Sn grains is 0.36±0.05 μm, and the average distance between grains is 0.42±0.03 μm. Compared with Example 1, the structure of the composite solder paste in this example is further refined.

Embodiment 3

[0028] Add nano-titanium dioxide powder (particle size 5-25nm) with a mass fraction of 0.1% to tin-silver-copper lead-free solder paste with a mass ratio of 96.5:3:0.5, and mechanically stir for more than 45 minutes to ensure that the titanium dioxide nanoparticles are uniform Distributed in tin-silver-copper lead-free solder paste, titanium dioxide nanoparticle-enhanced tin-silver-copper composite solder paste can be obtained.

[0029] The scanning electron microscope image of the composite solder paste obtained in this embodiment after reflow for 60s is as follows Figure 4 As shown, the gray matrix is ​​the tin-rich phase β-Sn, and the white particles are the intermetallic compound Ag 3 The average size of the Sn grains is 0.23±0.02 μm, and the average distance between the grains is 0.31±0.04 μm; compared with Example 2, the structure of the composite solder paste in this example is more refined.

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Abstract

The invention belongs to the technical field of welding materials and discloses tin-silver-copper composite solder paste enhanced by titanium dioxide nanoparticles and a preparation method thereof. The composite solder paste is obtained by blending tin-silver-copper lead-free solder paste and the titanium dioxide nanoparticles. The preparation method includes the following steps that the titanium dioxide nanoparticles are added into the tin-silver-copper lead-free solder paste with the mass ratio being 96.5:3:0.5, the titanium dioxide nanoparticles are evenly distributed in the tin-silver-copper lead-free solder paste through mechanical stirring, and accordingly the tin-silver-copper composite solder paste enhanced by the titanium dioxide nanoparticles is obtained. According to the tin-silver-copper composite solder paste, by adding the titanium dioxide nanoparticles, growth of an Ag3Sn phase in the solder paste is restrained, microhardness and mechanical property of the composite solder paste are improved, and growth of intermetallic compounds of a solder joint interface can be effectively restrained, crystal grains of the intermetallic compounds of the solder joint interface are refined, soldering reliability is improved, and the application prospect is good.

Description

technical field [0001] The invention belongs to the technical field of welding materials, and in particular relates to a titanium dioxide nanoparticle-reinforced tin-silver-copper composite solder paste and a preparation method thereof. Background technique [0002] Because the lead element in traditional tin-lead solder has great harm to human body and environment, tin-lead solder has been gradually replaced by lead-free solder. However, with the continuous miniaturization and high density of microelectronic products, the problems affecting the reliability of lead-free interconnection solder joints are becoming more and more serious. At present, there is no lead-free solder that can meet the performance requirements of the ultra-micronization development of the modern electronic assembly industry. Therefore, the research and development of high-reliability lead-free solders that meet the ultra-micronization of electronic packaging is an important task to be solved in modern...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26
CPCB23K35/262B23K35/025B23K35/3608
Inventor 李国元黄杰豪唐宇李振龙
Owner SOUTH CHINA UNIV OF TECH
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