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Method for measuring copper content in tin-silver-copper solder through iodometry

A tin-silver-copper and copper content technology, applied in the field of analysis and testing, can solve problems such as solution splashing, distortion, and affecting the accuracy and authenticity of the results, and achieve the effects of improving accuracy, facilitating operation, and shortening the measurement time

Inactive Publication Date: 2014-05-07
BEIJING INST OF NONFERROUS METALS & RARE EARTH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Generally, it is necessary to select appropriate media and reagents to remove the tin element, and improper selection of media and reagents will cause the solution to splash and distort, affecting the accuracy and authenticity of the results.

Method used

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  • Method for measuring copper content in tin-silver-copper solder through iodometry
  • Method for measuring copper content in tin-silver-copper solder through iodometry
  • Method for measuring copper content in tin-silver-copper solder through iodometry

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] In this example, tin 72 silver 20 copper 8 For example, to measure the content of copper wherein, the specific determination method steps are as follows:

[0045] 1. Standard substance analysis

[0046] 1) Take the standard substance, as shown in Table 1:

[0047] Table 1

[0048] Standard substance name

Copper content (%)

Sample weight (g)

pure copper

99.99

0.4016

pure copper

99.99

0.4046

[0049] 2) Dissolution of standard substances

[0050] Put the weighed standard substance in a 250ml beaker, add 8ml of concentrated nitric acid, cover with a watch glass, heat at 90°C until the sample dissolves, heat at 750°C to drive out nitrogen oxides, and cool. Transfer to a 200ml volumetric flask, make up to the mark with deionized water, and shake well;

[0051] 3) Fractionation and titration of standard substances

[0052] Take 10.00ml of the above standard solution in a 250ml Erlenmeyer flask, add 7ml of a...

Embodiment 2

[0079] In this example, tin 50 silver 10 copper 40 As an example to measure the content of copper wherein, the specific determination method steps are as follows:

[0080] 1, standard substance analysis, analysis process and the titer of standard solution copper are identical with embodiment 1.

[0081] 2. Sample analysis

[0082] 1) Weigh about 0.5000g sample, accurate to 0.0001g.

[0083] 2) Dissolution of the sample

[0084] Put the sample in a 250ml beaker bottle, add 10ml of sulfuric acid to heat to dissolve, remove it and cool it to room temperature, add 25ml of perchloric acid, after the sample is completely dissolved, heat until white smoke of perchloric acid is emitted, and drop in several times Catch tin with 35ml of concentrated hydrochloric acid, concentrate the solution to a small volume, remove and cool to room temperature, add 35ml of water, transfer to a 100ml volumetric flask to dilute to the mark with water, and shake well.

[0085] 3) Sample titration ...

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Abstract

Provided is a method for measuring copper content in tin-silver-copper solder through iodometry. The method comprises the following steps: a copper standard solution is prepared and the titer of the copper standard solution is measured. A sample to be measured is weighed and added into an Erlenmeyer flask. Concentrated sulfuric acid is added and the mixture is heated for dissolution. The above solution is cooled to the room temperature, perchloric acid is added, after the sample is dissolved fully, heating is carried out until white smoke is generated, concentrated hydrochloric acid is dropwise added into the above solution in batches to remove the tin element in the solution, and the solution is subjected to concentration. The Erlenmeyer flask is taken down and cooled to the room temperature, deionized water is added, the constant volume is 100mL and the above solution is shaken up. Then an ammonium hydroxide solution is added and copper ammonia complex ions are formed. Then ammonium bifluoride is added into the solution and stirred until the blue color disappears. The above solution is cooled to the room temperature by utilization of running water. The solution is placed for half a minute, then potassium iodide is added, and immediately the solution is subjected to titration by a sodium hyposulfite standard solution until a shallow yellow color appears. Then a potassium thiocyanate solution and a starch solution are added, and the solution is subjected to titration by the sodium hyposulfite standard solution until a blue color disappears. The volume of the consumed sodium hyposulfite solution is recorded, and the content of copper in the sample is calculated.

Description

technical field [0001] The invention relates to a method for measuring copper content in tin-silver-copper solder by iodometric method, belonging to the technical field of analysis and testing. Background technique [0002] With the development of analysis and testing technology at home and abroad, various testing companies have correspondingly improved the analysis and testing level of their products in order to adapt to the fierce competition in the market. At present, the analysis method of silver-copper solder in my country is carried out according to the standard JS / T11020-1996. However, it does not apply to analytical methods containing tin. The analysis method of silver-copper-tin solder is carried out according to the national standard YB946 (Ag~11)~78, but it only measures the total amount of copper and tin, and the amount of copper cannot be directly measured, and tin itself is also important for the determination of copper content. There is some interference. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N21/78G01N1/28
Inventor 范树辉刘吉玲许丽娟郭飞姚芳
Owner BEIJING INST OF NONFERROUS METALS & RARE EARTH
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