Stainless steel / alumina ceramic low stress hermetic seal solder
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- SINO PLATINUM METALS CO LTD
- Publication Date
- 2009-07-08
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
technical field
[0001] The invention relates to the field of electric vacuum device manufacturing in the electronic industry, in particular to silver alloy composite brazing filler metal used for vacuum switch tube stainless steel and 95% alumina ceramic low-stress hermetic joint. Background technique
[0002] In recent years, in the field of electric vacuum device manufacturing, in order to reduce the cost of products in mass-produced vacuum switch tubes, stainless steel is used to replace the high-cost low-expansion coefficient Kovar alloy, that is, stainless steel end caps and 95% aluminum oxide are used. Ceramic tube sealing structure, the new problem of this sealing structure is: the expansion coefficient of stainless steel and ceramics is very different (at 20 ~ 500 ℃, the linear expansion coefficient of 95% alumina ceramics is (6.5 ~ 7.5) × 10 -6 / °C, the linear expansion coefficient of stainless steel is 17.9×10 -6 / °C), they cannot form a matching seal, and the str...