Preparation method of tin-based silver graphene lead-free composite solder

A technology of composite solder and silver graphite, which is applied in the direction of manufacturing tools, welding equipment, metal processing equipment, etc., can solve the problems of poor bonding strength of the metal matrix and difficulty in uniform distribution, so as to improve load transfer, refine grains, and improve Effect of Particle Distribution Uniformity

Inactive Publication Date: 2015-12-23
TIANJIN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In order to improve the problems that the graphene-enhanced Sn-based solder exists in the matrix that is difficult to uniformly distribute and has poor bonding strength with the metal matrix, the present invention selects Ag particle-modified graphene as the reinforcing material to improve the bonding of nano-silver-modified graphene and Load transfer between Sn matrix for better strengthening effect

Method used

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  • Preparation method of tin-based silver graphene lead-free composite solder
  • Preparation method of tin-based silver graphene lead-free composite solder
  • Preparation method of tin-based silver graphene lead-free composite solder

Examples

Experimental program
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Effect test

Embodiment 1

[0024] Embodiment 1, prepare tin-based silver graphene lead-free composite solder, the steps are as follows:

[0025] (1) take by weighing 30mg graphene with electronic balance, 10mg sodium lauryl sulfate, then mix it, measure the dimethylformamide of 40ml with graduated cylinder, mix the SDS (10mg) of 30mg graphene and 10mg Sodium dialkylsulfate) was added to 40ml of DMF (dimethylformamide), and sonicated for 2 hours.

[0026] (2) Measure the silver nitrate solution that 20ml molar concentration is 0.06mol / ml with graduated cylinder again, add the mixed solution that step (1) makes to it, ultrasonic treatment 30 minutes, graphene is obtained better modification, then in After heating at 70°C for 1 hour, filter, wash with water and then with alcohol to obtain silver graphene nanosheets (AG-GNSs).

[0027] (3) Then weigh a certain amount of 96.5Sn-3.0Ag-0.5Cu alloy powder and mix it with silver graphene nano-silver sheets (AG-GNSs) prepared in step (2) (using 96.5Sn-3.0Ag-0.5C...

Embodiment 2

[0032] Embodiment 2, preparation tin-based silver graphene lead-free composite solder, step is basically the same as embodiment 1, and its difference is only in:

[0033] Step 3: when mixing 96.5Sn-3.0Ag-0.5Cu alloy powder with silver graphene nano-silver sheets (AG-GNSs), the mass fraction of silver-graphene nano-sheets in the mixed powder is 0.05%.

Embodiment 3

[0034] Embodiment 3, preparation tin-based silver graphene lead-free composite solder, step is basically the same as embodiment 1, and its difference is only in:

[0035] Step 3: when mixing 96.5Sn-3.0Ag-0.5Cu alloy powder with silver graphene nano-silver sheets (AG-GNSs), the mass fraction of silver-graphene nano-sheets in the mixed powder is 0.1%.

[0036] figure 1 For prior art Sn-Ag-Cu lead-free solder and embodiment 1, embodiment 2, embodiment 3 strengthen the comparative schematic diagram of the wetting angle of lead-free solder by silver graphene nanosheet, by figure 1 It can be seen that with the increase of the mass fraction of silver graphene nanosheets, the wetting angle also gradually decreases, from 40° when no addition to 22° in Example 3.

[0037] figure 2 It is a schematic diagram comparing the tensile strength value of the Sn-Ag-Cu lead-free solder of the prior art and the tensile strength value of the lead-free solder enhanced by silver graphene nanosheets...

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Abstract

The invention discloses a preparation method of tin-based silver graphene lead-free composite solder. The method comprises the steps that a certain amount of graphene and lauryl sodium sulfate are mixed, then a certain amount of dimethylformamide is added, ultrasonic treatment is performed for 2 h, a certain amount of silver nitrate is added into a mixed solution, ultrasonic treatment is performed continuously, and finally a self-made silver graphene nanosheets are obtained; and required solder matrix powder is weighed according to different graphene mass fractions and poured into a ball milling tank for ball milling for 5 h, the powder is placed into a stainless steel mold after being dried and placed under a hydraulic machine to be pressed and molded at the pressure of 500 Mpa, and then a cylinder obtained through cold pressing is placed into a high-vacuum tubular resistance furnace for vacuum sintering for 2 h at the temperature of 175 DEG C and placed under the hydraulic machine after being cooled to the room temperature to obtain a cylinder through impact extrusion. According to the preparation method, Ag-particle-modified graphene is selected as a strengthening material so as to improve load transmitting between the nano-silver-modified graphene and a Sn matrix, and therefore the better strengthening effect is achieved.

Description

technical field [0001] The invention relates to the preparation of composite solder, which is a method for preparing composite solder by adding silver graphene nanosheets to traditional 96.5Sn-3.0Ag-0.5Cu solder and using a ball milling process. Background technique [0002] For a long time, tin-lead alloy solder has been widely used in the electronics industry. Its brazing joints are an indispensable key part of electronic devices. They serve as interconnect materials to provide mechanical support between circuit devices, circuit conduction and heat transfer channels. , but lead is potentially harmful to human health and the natural environment. In addition, with the development of microelectronics technology, electronic products are developing in the direction of miniaturization and portability, which makes the brazing joints of electronic packages more and more dense, while the calorific value per unit volume of electronic products is increasing. The service temperature ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/40B23K35/26B22F1/05
CPCB23K35/0227B23K35/262B23K35/40B22F1/05B23K35/3601B23K35/0244C22C47/14C22C49/02C22C49/14B22F2998/10B22F2999/00C22C13/00C22C1/05B22F2009/043B22F3/02B22F3/10B22F2201/20B22F2201/11B23K35/26B22F9/04B22F2301/30B22F2304/10
Inventor 荆洪阳刘暾徐连勇韩永典王丽霞
Owner TIANJIN UNIV
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