Melting-point-changeable lead-free composite soldering material, soldering paste, thire preparation and use

Abstract

The invention discloses a lead-free composite solder and solder paste with variable melting point and their preparation and application methods. It belongs to the preparation technology field of composite lead-free solder/solder paste. The solder/solder paste is prepared by mechanical mixing of general soldering powder and flux with different melting points. It has advantages of strong sagging resistance, strong rigidity, high tenacity, long service life, bright melting point halo and simple preparation technology in the process of welding and working. Its great character is to realize low-temperature welding of middle/high temperature solder or gradient temperature welding without changing the welding process route and parameters of original lead-containing solder. It can realize the middle/high temperature application of low-temperature solder and prolong their service lives.

Description

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AI Technical Summary

Benefits of technology

The inventive composition described by this patented solution provides an effective way for joining electronic parts together without causing damage or discomfort from excess heat generated when they are joined through resistance spot welds. It also prevents cracks caused by thermal shock while maintaining its strength against collapses. Additionally, it suggests adding different types of metal powders into certain compositions to further enhance their properties such as lower temperatures at specific points within the assembly's range.

Problems solved by technology

Technological Problem: Current Leadless Soluble Silver Layer Thin Film Attack Tables (SLT) made up of various metals like silver, gold, zinc, bismuth, nickels, cobalt, manganese, iron, ceramic, platins, selenium, tellurian elements, pyroelectric materials, magnetic insulators, amorphous silicon dioxides, calcium phosphate, talcum sulfites, graphite flakes, and glass filler compositions. These technical problem addressed through this patented solution involves selecting appropriate base ingredients without compromising the stability of the overall system being formed due to factors like lower temperatures required for heat conduction. Additionally, developing a new type of lead free solvent based compound called BFSAPE resin that meets all three important criteria mentioned above needs to address issues associated with current methods involving multiple steps and adjustment processes.

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