The invention discloses a production method of a high-density multilayer circuit board, and relates to the technical field of circuit boards, the production method comprises
cutting, a
control room is fixedly mounted on the right side of the
cutting, and a pattern transfer device is fixedly mounted on the right side of the
control room. The control chamber fixedly installed on the right side of the
cutting machine plays a role in
intelligent control and adjustment, the pattern transfer device fixedly installed on the right side of the control chamber achieves the effect of inner and outer layer separation work, and meanwhile, plate
grinding and film pasting are achieved through the effect of the inner and outer pattern
layers; comprising a circuit pattern and a photoinduced solder
resist pattern, the function is realized through
irradiation of
ultraviolet light, the irradiated local area is cured, and then the circuit pattern or the solder
resist pattern is formed through development, so that the development has excellent resolution, the circuit quality can be obviously improved, and the production cost is reduced. The improvement of the
etching quality is greatly related to the acceleration of the
etching rate, and the photosensitive
adhesive coated on the surface of the
copper foil is removed by the inner layer mold stripping.