Magnetic particle tin-zinc matrix composite solder and preparation method thereof

A magnetic particle, composite welding technology, applied in welding equipment, welding/cutting media/materials, welding media, etc., can solve the problems of weak bonding force and difficulty in joining, and achieve increased fluidity, improved wettability, and improved Beneficial effects on mechanical properties

Inactive Publication Date: 2012-06-27
SOUTHEAST UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In addition, magnetic particle composite solder has also been reported, but the added particles have

Method used

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  • Magnetic particle tin-zinc matrix composite solder and preparation method thereof
  • Magnetic particle tin-zinc matrix composite solder and preparation method thereof
  • Magnetic particle tin-zinc matrix composite solder and preparation method thereof

Examples

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Effect test

Embodiment 1

[0035] Embodiment 1: The tin-zinc based composite solder of the present invention, the weight percentage of each component is: 99% of tin-zinc solder matrix, 1% of magnetic particles. The Zn content in the tin-zinc solder matrix is ​​8% by weight of the tin-zinc-based solder matrix, the balance is Sn, and the magnetic particles are Fe particles with a particle size of 10um. The Ni plating layer obtained by keeping the temperature at 90°C for 5min in the plating solution is about 1um magnetic particles.

Embodiment 2

[0036] Embodiment 2: In the tin-zinc based composite solder of the present invention, the weight percentage of each component is: tin-zinc solder matrix 95%, magnetic particles 5%. The Zn content in the tin-zinc solder matrix is ​​9% by weight of the tin-zinc-based solder matrix, the balance is Sn, and the magnetic particles are Fe particles with a particle size of 20um. The Ni plating layer obtained by keeping the temperature at 90°C for 8 minutes in the plating solution is about 2um magnetic particles.

Embodiment 3

[0037] Embodiment 3: The tin-zinc based composite solder of the present invention, the weight percentage of each component is: 95% of tin-zinc solder matrix, 5% of magnetic particles. The Zn content in the tin-zinc solder matrix is ​​9% by weight of the tin-zinc-based solder matrix, the balance is Sn, and the magnetic particles are Fe particles with a particle size of 20um. The Ni plating layer obtained by keeping the temperature at 90°C for 10min in the plating solution is about 3um magnetic particles.

[0038] : Embodiment 4: tin-zinc based composite solder of the present invention, the percentage by weight of each component is: 90% of tin-zinc solder matrix, 10% of magnetic particles. The Zn content in the tin-zinc solder matrix is ​​10% by weight of the tin-zinc-based solder matrix, the balance is Sn, and the magnetic particles are Fe particles with a particle size of 30um. The Ni plating layer obtained by keeping the temperature at 90°C for 10min in the plating solution is ...

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Abstract

The invention discloses a magnetic particle tin-zinc matrix composite solder and a preparation method thereof. The magnetic particle tin-zinc matrix composite solder comprises a Sn-Zn-based solder matrix and 10 percent of magnetic particles, wherein the tin-zinc-based solder matrix comprises Sn and Zn, and Zn accounts for 8 to 10 percent relative to the weight of the tin-zinc-based solder matrix in percentage by weight; and the magnetic particles are Fe particles of which the surfaces are plated with Ni layers. Because of the presence of the plated Ni layers, the Fe particles can be more easily added into the solder matrix, so that a method for adding the particles is simplified, the particles and the matrix are combined more tightly, the magnetic force can play a greater role, the same effect can be achieved by using fewer magnetic particles, raw materials are saved, and the cost is saved; and part of the plated Ni layers is blended into the matrix to improve the performance of the matrix. The magnetic particle tin-zinc matrix composite solder disclosed by the invention has a simple preparation method, special magnetic performance and good wetting property.

Description

technical field [0001] The invention belongs to the field of electronic device welding and surface packaging materials, in particular to a composite lead-free alloy solder with unique magnetic properties and high wettability and a preparation method thereof. Background technique [0002] Due to the great harm of lead to the human body and the environment, Sn-Pb solder has been gradually replaced by lead-free solder. Among many lead-free solder systems, Sn-Zn-based solder has attracted the attention of researchers because of its melting point (199°C) close to that of traditional Sn-Pb solder (183°C), better mechanical properties, abundant resources, and low production costs. However, the two major disadvantages of poor wettability and poor oxidation resistance limit the application of Sn-Zn-based solders. In current research, alloying and microalloying are mainly used to improve the oxidation resistance and wettability of Sn-Zn based solders. [0003] Chinese patent CN20051...

Claims

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Application Information

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IPC IPC(8): B23K35/26B23K35/40C22C13/00C22C1/04B22F9/08C23C18/36
Inventor 周健姚瑶刘思栋陈旭薛烽白晶
Owner SOUTHEAST UNIV
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