Preparation method of foam metal composite solder piece

A foam metal and metal solder technology, which is applied in metal processing equipment, metal material coating technology, welding equipment, etc., can solve the problem that the real addition amount of elements is difficult to accurately control, the performance of the solder cannot be improved, and the particle reinforcement phase is difficult to achieve. Uniform distribution and other issues to achieve the effect of reducing the content of weak structures, facilitating welding operations, and improving ductility

Active Publication Date: 2017-06-13
无锡继平新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Affected by the smelting process, it is difficult to accurately control the actual amount of elements added in the solder alloying process, which cannot achieve the purpose of improving the performance of the solder.
The mechanical properties of the solder can be improved to a certain extent by adding micron-scale or nano-scale metal or non-metallic and related oxide particles, but the particle-reinforced phase is difficult to distribute evenly and is easy to agglomerate, which still cannot meet the needs of people in engineering applications. Requirements for mechanical properties such as strength

Method used

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  • Preparation method of foam metal composite solder piece
  • Preparation method of foam metal composite solder piece

Examples

Experimental program
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Effect test

Embodiment 1

[0025] The metal foam substrate selected in this embodiment is spherical open-cell aluminum foam, the electroplating active metal coating is nickel, and the Sn metal substrate is pure Sn alloy. The specific operation steps are as follows:

[0026] After the aluminum foam with a size of 60mm×80mm has been degreased and derusted, it is cleaned in an ultrasonic environment for 10 minutes, and then the surface is roughened and cleaned with ultrasonic cleaning and deionized water for 10 minutes each; preheated in a deionized water bath for 10 minutes, The preheating temperature is 40°C, followed by ultrasonic assisted plating. The anode is a nickel plate, the cathode is the aluminum foam workpiece to be plated, the electroplating temperature is 40°C, the electroplating time is 30min, and the current density is 1A / dm 2 ; Ultrasonic power 5w / L, frequency 80kHz, ultrasonic action time 20min. After the electroplating is completed, the composite foamed aluminum material obtained is pla...

Embodiment 2

[0029] The metal foam substrate selected in this embodiment is spherical open-cell titanium foam, the electroplating active metal coating is Cu, and the Sn metal substrate is a Sn-Cu alloy. The specific steps are as follows:

[0030] After the titanium foam with a size of 50mm×90mm is degreased and derusted, it is cleaned in an ultrasonic environment for 12 minutes, and then the surface is roughened and cleaned with ultrasonic cleaning and deionized water for 12 minutes each; preheated in a deionized water bath for 10 minutes, The preheating temperature is 35°C, followed by ultrasonic assisted plating. The anode is graphite, the cathode is titanium foam workpiece to be plated, the electroplating temperature is 35°C, the electroplating time is 30min, and the current density is 1A / dm 2 ; Ultrasonic power 5w / L, frequency 80kHz, ultrasonic action time 20min. After the electroplating is completed, the composite aluminum foam material obtained is placed in soybean oil for dehydroge...

Embodiment 3

[0033] The metal foam substrate selected in this embodiment is spherical open-cell foam copper, the active metal coating is nickel, and the Sn metal substrate is a Sn-Zn alloy. The specific steps are as follows:

[0034]After the copper foam with a size of 50mm×90mm has been degreased and derusted, it is cleaned in an ultrasonic environment for 12 minutes, and then the surface is roughened and cleaned with ultrasonic waves and deionized water for 12 minutes each; preheated in a deionized water bath for 10 minutes, preheated The heat temperature was 50°C, followed by ultrasonic assisted plating. The anode is graphite, the cathode is copper foam workpiece to be plated, the electroplating temperature is 50°C, the electroplating time is 30min, and the current density is 2A / dm 2 ; Ultrasonic power 5w / L, frequency 60kHz, ultrasonic action time 20min. The components of the electroplating solution and the concentration of each component are as follows: NiSO 4 ·6H 2 O, 10g / L; NiCl ...

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Abstract

The invention discloses a preparation method of a foam metal composite solder piece. According to the method, firstly, the surface of foam metal is treated, the surface of a foam metal matrix is coated with one or more layers of active metal with an electroplating or chemical plating process, annealing treatment is performed, the foam metal with an active metal plating layer is infiltrated into molten solder and taken out after filling is performed, foam metal enhanced low-melting-point composite solder is obtained, finally, calendaring machining is performed, metal solder foil with certain thickness is obtained, and the purposes of improving the strength and the welding performance of foam metal composite solder are achieved. The foam metal is used for enhancing Sn-based or Zn-based solder, and the applied active metal plating layer can improve the strength of the foam metal matrix to a certain extent and make up the influence of foam metal porosity on the strength of the foam metal. Besides, the active metal plating layer is also beneficial to filling of low-melting-point solder to the foam metal and relieves the unfavorable situation that tin and matrix metal are difficult to infiltrate and interface bonding is not firm.

Description

technical field [0001] The invention relates to the field of welding technology, in particular to a method for preparing a metal foam composite solder sheet. Background technique [0002] With the development of the electronics industry and people's higher and higher requirements for product performance, improving the mechanical properties such as the strength of solder has gradually become an important direction for improving product quality. At present, the solders that are widely studied are Sn-Ag-Cu, Sn-Ag, Sn-Cu and Sn-Zn solders. Due to their defects such as poor oxidation resistance, poor wettability, and insufficient strength, they are subject to certain restrictions in engineering applications. limit. The methods usually used to improve the mechanical properties such as solder strength mainly include alloying and particle reinforcement. Affected by the smelting process, it is difficult to accurately control the actual amount of elements added during the solder all...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/40C25D5/20C25D3/12C25D3/38C23C2/08C23C28/02
CPCB23K35/40C23C2/08C23C28/021C23C28/023C25D3/12C25D3/38C25D5/20
Inventor 肖勇宋志鹏李姗毛永灵张星祎王奇伟黄尚宇
Owner 无锡继平新材料科技有限公司
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