Soldering coal composition used for preparing tin solder paste

A composition and solder paste technology, applied in welding media, manufacturing tools, welding equipment, etc., can solve the problems of inability to provide paste release and lubricity, insufficient to provide thermal collapse resistance, etc., and achieve excellent printability and cold and hot collapse resistance, good wettability and storage stability, and the effect of meeting technical requirements

Inactive Publication Date: 2006-04-12
李昕
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

From a practical point of view, hydrogenated castor oil (or modified hydrogenated castor oil) has excellent cold thixotropy, but its softening point is below 100°C, which is not enough to provide heat slump resistance. When applying lead-f

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] 1. Solvent component: 2-ethyl-1,3-hexanediol 294g

[0034] Diethylene glycol monobutyl ether 50g

[0035] C13~14 normal alkanes 50g

[0036] 2. Carrier resin component: 685 esterified rosin 250g

[0037] 610 esterified rosin 100g

[0038] Carrier rheology agent component: di(p-methyl)benzyl sorbitol 40g

[0039] Salicylic acid amide 20g

[0040] Hydrogenated Castor Oil 30g

[0041] Carrier stabilizer component: modified alkylphenol polyoxyethylene ether compound Igepal TM CTA 639W 33g

[0042] Hydroquinone 3g

[0043] Benzimidazole fatty amine salt 40g

[0044] Benzimidazole 10g

[0045] 3. Active agent component: succinic acid 20g

[0046] Adipic acid 5g

[0047] Sebacic acid 5g

[0048] 12-Hydroxystearic Acid 50g

[0049] The above components are made into welding coal for future use. ...

Embodiment 2

[0053] 1. Solvent component: 2-ethyl-1,3-hexanediol 144g

[0054] Diethylene glycol monohexyl ether 50g

[0055] C13~14 normal alkanes 50g

[0056] 2. Carrier resin component: 685 esterified rosin 250g

[0057] 610 esterified rosin 100g

[0058] Carrier rheology agent component: di(p-methyl)benzyl sorbitol 40g

[0059] Salicylic acid amide 30g

[0060] Ethylene Bis Stearamide 100g

[0061] Carrier stabilizer component: modified alkylphenol polyoxyethylene ether compound Igepal TM CTA 639W 33g

[0062] Hydroquinone 3g

[0063] Benzimidazole fatty amine salt 40g

[0064] Benzimidazole 10g

[0065] 3. Active agent component: cyclohexylamine hydrobromide 30g

[0066] Succinic acid 20g

[0067] 12-Hydroxystearic Acid 50g

[0068] Hexadecenedioic acid 50g

[0069] The above components are made into welding coal for fut...

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PUM

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Abstract

A composite solder flux used to prepare the tin solder for PCB is composed of carrier, activator and solvent. Said carrier consists of the rheological agent prepared from p-methylenebenzyl sorbitol and at least one of amide stearate, amide aciculate, amide ethylenedistearate, and hydrogenated castor oil or modified hydrogenated castor oil, the stabilizer prepared from nonylphenol polyoxyvinylether, (modified) alkylphenol polyoxyvinylether, reducer, benzimimidazole lipoamine salt and benzimimidazole, and the resin.

Description

technical field [0001] The invention relates to a soldering flux vehicle (Solderingflux vehicle) for preparing solder paste for surface mounting (SMT) technology of electronic components, in particular to the selection of carrier components in the soldering flux. Background technique [0002] The surface mount (SMT) process of electronic components is an indispensable technology in the mass production of printed circuit boards, and its application range is more and more extensive. The solder paste is printed onto the pads of the circuit board through a stainless steel template; various components are attached to the pads by manual or automatic mounting, and then reflowed through a reflow furnace to automatically complete the soldering of the printed circuit board. The above process That is the so-called SMT process. [0003] Solder paste is formulated from spherical alloy powder and solder coal. From the point of view of practical application, soldering coal is the key fac...

Claims

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Application Information

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IPC IPC(8): B23K35/36
Inventor 李昕
Owner 李昕
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