The invention discloses a QFP (quad flat package) device pin molding fixture and a using method thereof. The pin molding fixture comprises a top cover, a base, a first clamping opening and a second clamping opening, wherein a plurality of fixed columns are arranged on the base; the top cover is arranged above the base through the plurality of fixed columns and can move up and down along the fixedcolumns; the first clamping opening is arranged at the bottom of the top cover and is formed by two platy objects which are perpendicular to the bottom surface of the top cover and are oppositely arranged; the second clamping opening is arranged on the top of the base and is formed by two platy objects which are perpendicular to the top surface of the base and are oppositely arranged; and the first clamping opening and the second clamping opening are aligned face to face to form a clamping part of a QFP device, so that the QFP device is located between the first clamping opening and the secondclamping opening, and pins to be machined and molded, of the QFP device are exposed out of the clamping part. The fixture provided by the invention is simple in structure and convenient to operate, can clamp a chip so as to prevent the chip from moving in the molding process of the chip, and then molds the chip by smearing along a molding surface; the chip is molded at a time; and the pins have consistent shapes and high accuracy.