Ceramic quad flat package (CQFP) series aging test socket with pitch being no less than 0.8mm

Abstract

The invention discloses a ceramic quad flat package (CQFP) series aging test socket with pitch being no less than 0.8mm. The CQFP series aging test socket comprises an installation plate and a cover plate which are movably hinged through a hinge shaft. The CQFP series aging test socket is characterized in that a torsion spring is sheathed on the hinge shaft, a clamping block which is in clamping fit with the installation plate is arranged at the end part of the cover plate, contact pieces with quantity being equal to the quantity of leads of a package are installed on the installation plate, the upper end of each contact piece is a contact end, the lower end of each contact piece is a welding end, the two sides of the middle part of each contact piece are respectively provided with a press fitting part and each press fitting part is provided with a barb. The back surface of the cover plate of the CQFP series aging test socket is provided with teeth, wherein the quantity of the teeth is equal to the quantity of the contact pieces and the width of the teeth is less than the slot width of the installation plate and is more than the width of the leads of the package. The teeth are used for providing enough pressure to the leads of the package through the contact pieces. The upper surface and the lower surface of the cover plate are provided with a plurality of process slots. The CQFP series aging test socket can be used for the aging test of the package both before forming and after forming, and is easy to machine and assemble. The structure of the CQFP series aging test socket is a novel structure which is designed according to the structural characteristics of the package, the package is convenient to place and position and the package can be well protected during testing.

Description

technical field [0001] The invention relates to the field of burn-in test sockets, in particular to CQFP series burn-in test sockets with a pitch not less than 0.8 mm. Background technique [0002] Domestically, the CQFP series packaging form with a pitch greater than or equal to 0.8mm is without insulating ribs, and its leads are slender "one" shape before molding, and "L" shape after molding. According to the requirements of the integrated circuit packaging process, the integrated circuit package should be subjected to burn-in tests before and after molding. At present, there are generally two structural types of sockets required for this type of packaging in China, the structure of the test socket before molding and after molding. The form is different. Before molding, the package is first fixed in the two-piece protection device, and then placed on the contact sheet, and the cover is locked and then subjected to burn-in test, which is very troublesome for users to use; ...

AI Technical Summary

Problems solved by technology

Before molding, the package is first fixed in the two-piece protection device, and then placed on the contact piece, and the cover is locked and then subjected to burn-in test, which is very troublesome for users to use; although the socket used after molding A positioning device is designed, but because the positioning device is relatively small, and its function can only isolate each contact piece, the structure on the pressing plate that applies force to the lead wire of the package is a plane, and the user may have poor contact when using it.

Moreover, users need to purchase two kinds of sockets for aging tests before and after molding, which increases the cost

[0003] At present, the most commonly used material for sockets developed in China is polyphenylene sulfide (PPS). This material can only continue to work at a high temperature of 260°C without external force, but due to its low heat distortion temperature, it is only 115°C. Therefore, if the stressed parts are deformed at high temperature, the socket will fail

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