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Semiconductor device and packaging method thereof

A technology of semiconductors and semiconductor tubes, applied in the field of assembling quad flat package semiconductor devices

Inactive Publication Date: 2013-01-23
FREESCALE SEMICON INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At the same time, the same or more input and output (I / O) is required for this circuit, which is a considerable challenge for packaging engineers

Method used

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  • Semiconductor device and packaging method thereof
  • Semiconductor device and packaging method thereof
  • Semiconductor device and packaging method thereof

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Embodiment Construction

[0012] Detailed exemplary embodiments of the present invention are disclosed herein. However, specific structures and functions disclosed in detail herein are merely representative for purposes of describing example embodiments of the present invention.

[0013] now refer to figure 2 , shows a cross-sectional view of the semiconductor device 40 . Semiconductor device 40 includes lead frame 42 having die flag 44 . Lead frame 42 may be formed from metal or metal alloys. In certain exemplary embodiments, lead frame 42 may be formed from copper, copper alloys, iron, aluminum, aluminum alloys, steel, or other suitable materials. The lead frame may also be coated with another metal material such as palladium. Lead frames are well known to those skilled in the art, and those skilled in the art will appreciate that the lead frame of the present invention may comprise a variety of materials and may be formed in a variety of ways, such as cutting, stamping and etching.

[0014] Sem...

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Abstract

The invention provides a semiconductor device and a packaging method thereof. A quad flat packaging (QFP) device comprises a semiconductor tube core which is attached to a mark of a lead frame. A bonding pad of the tube core is electrically connected with internal and external leads of the lead frame by bonding wires. The tube core, a tube core mark, the bonding wires and the partial internal and external leads are covered by molding compounds, so that a packaging main body is defined. The external lead is similar to a gull wing-shaped lead of the traditional QFP device; and the internal lead forms a contact point on the bottom surface of the packaging main body. Cutting is performed on the internal side of the internal lead so as to separate the internal lead and the tube core pad.

Description

technical field [0001] The present invention relates generally to the packaging of semiconductor devices, and more particularly, to methods of assembling quad flat pack (QFP) semiconductor devices. Background technique [0002] The size of semiconductor integrated circuits continues to decrease and there is a corresponding demand for such smaller but higher density circuits. At the same time, it is required to provide the same or more input and output (I / O) for this kind of circuit, which is a considerable challenge for packaging engineers. Some types of semiconductor packages use a lead frame having leads or lead fingers for interconnecting the semiconductor die and external circuitry. Typically, the contacts or pads on the semiconductor die are electrically coupled to respective leads or lead fingers by bond wires. [0003] FIG. 1 shows a cross-sectional view of a conventional quad flat package (QFP) 10 having a semiconductor die 12 . Die 12 is supported by and attached...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/60H01L23/495
CPCH01L2224/49109H01L24/49H01L24/85H01L23/3107H01L2924/1815H01L23/49551H01L23/49503H01L24/48H01L2224/73265H01L2224/32245H01L2224/48247H01L24/45H01L24/73H01L2224/45124H01L2224/45144H01L2224/45147H01L2224/45565H01L2224/45664H01L2924/00014H01L2924/181H01L2924/00012H01L2224/45015H01L2924/207
Inventor 梅鹏林刘立威叶德洪
Owner FREESCALE SEMICON INC
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