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QFP (quad flat package) device pin molding fixture and using method thereof

A molding tooling and molding processing technology, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as inconsistent pins, and achieve the effect of easy processing and use, convenient operation, and consistent shape

Pending Publication Date: 2018-09-28
SHANGHAI INST OF SPACE POWER SOURCES
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the problem of inconsistencies in the fast pin forming of QFP devices, and to provide a tool for precise forming of pins

Method used

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  • QFP (quad flat package) device pin molding fixture and using method thereof
  • QFP (quad flat package) device pin molding fixture and using method thereof
  • QFP (quad flat package) device pin molding fixture and using method thereof

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Embodiment Construction

[0036] The technical solutions of the present invention will be further described below in conjunction with the drawings and embodiments.

[0037] Such as figure 1 As shown, the present invention provides a kind of QFP device pin molding tooling, and this tooling comprises:

[0038] top cover 10,

[0039] A base 20, the base 20 is provided with a number of fixed columns 21, the top cover 10 is installed above the base 20 through the fixed columns 21, the top cover 10 can move up and down along the fixed columns 21 (vertical to the longitudinal movement of the base);

[0040] The first jaw 11 provided at the bottom of the top cover 10 is composed of two plates perpendicular to the bottom surface of the top cover;

[0041] The second jaw 22 arranged on the top of the base is composed of two plates perpendicular to the top surface of the base;

[0042] Wherein, the first jaw and the second jaw 22 of 11 are relatively aligned and arranged to constitute the clamping part of the ...

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Abstract

The invention discloses a QFP (quad flat package) device pin molding fixture and a using method thereof. The pin molding fixture comprises a top cover, a base, a first clamping opening and a second clamping opening, wherein a plurality of fixed columns are arranged on the base; the top cover is arranged above the base through the plurality of fixed columns and can move up and down along the fixedcolumns; the first clamping opening is arranged at the bottom of the top cover and is formed by two platy objects which are perpendicular to the bottom surface of the top cover and are oppositely arranged; the second clamping opening is arranged on the top of the base and is formed by two platy objects which are perpendicular to the top surface of the base and are oppositely arranged; and the first clamping opening and the second clamping opening are aligned face to face to form a clamping part of a QFP device, so that the QFP device is located between the first clamping opening and the secondclamping opening, and pins to be machined and molded, of the QFP device are exposed out of the clamping part. The fixture provided by the invention is simple in structure and convenient to operate, can clamp a chip so as to prevent the chip from moving in the molding process of the chip, and then molds the chip by smearing along a molding surface; the chip is molded at a time; and the pins have consistent shapes and high accuracy.

Description

technical field [0001] The invention belongs to the technical field of electronic assembly and relates to a lead forming tool, in particular to a QFP device lead forming tool and a use method thereof. Background technique [0002] Square flat package technology (Plastic Quad Flat Package, referred to as QFP), this technology realizes that the distance between the pins on the four sides of the CPU chip is very small, and the pins are very thin. [0003] The main molding method of the existing chip molding tool is to use two matching templates, the upper and the lower, to place the chip in the template, and then press the other template by fixing one template to form. The clamping and forming of this molding method are completed together, that is, the chip pins are molded at the same time as the chip is clamped, which is also the shortcoming of this type of tooling. When the chip is not fully clamped, the molded chip pins are prone to the risk of the chip slipping during the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B21F1/00H01L21/48
CPCH01L21/4896B21F1/004
Inventor 颜志毅刘瑜李敏杨佩顾威朱景春胡乐亮顾基炜
Owner SHANGHAI INST OF SPACE POWER SOURCES
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