The invention discloses a method for improving
copper electrodeposition quality, which belongs to the technical field of
copper electrodeposition, and comprises the following steps: preparing a
copper sulfate electrodeposition solution; adding a composite additive consisting of an extracting agent,
thiourea or / and
chloride ions into the copper electrodeposition solution, uniformly mixing, and conveying into an electrodeposition tank; the Pb-Sn-Ca
anode plate is placed in a pretreatment solution to be subjected to activating treatment, and a uniform and compact
lead dioxide coating is formed on the surface of the Pb-Sn-Ca
anode plate; a plurality of activated Pb-Sn-Ca
anode plates and 316L stainless steel
cathode plates are alternately arranged in an electrodeposition
cell at intervals, the whole electrodeposition
cell is placed in a bath type ultrasonic wave generating device for electrodeposition treatment, an electrodeposition copper sheet is obtained, and
cell voltage is recorded. According to the invention, an anode plate pretreatment activation process is adopted, a composite additive is added to optimize an
electrode liquid formula, and an ultrasonic strengthening means is supplemented, so that the current efficiency in the copper electrodeposition process is improved, and the copper electrodeposition surface appearance and roughness are effectively improved.