A kind of glass material for high temperature and high pressure sealing and preparation method thereof

Abstract

The invention discloses a high temperature and high pressure resistant glass material for sealing and a preparation method thereof, which is prepared from the following components in parts by weight: SiO2: 9-12 parts; H3BO3: 25-27 parts; Al2O3: 4-6 parts; SrCO3 : 5 to 8 parts; Pb3O4: 50 to 53 parts; other impurity elements inevitably brought in: ≤1 part. The preparation method of the above-mentioned high temperature and high pressure resistant glass material comprises the following steps: a) batching; b) ball milling; c) pre-sintering; e) heat preservation and sintering; e) water quenching; f) ball milling; g) sieving; h )dry. The invention also provides a method for encapsulating the above-mentioned high-temperature and high-pressure-resistant sealing glass material with an alloy and a performance testing method. The sealing glass material of the present invention can be matched and sealed with Kovar alloy or other lead metals and stainless steel alloys of different grades, and has excellent sealing strength and quality; by controlling the packaging method, the sealing member can be used normally in high temperature, high pressure environment and destructive environment , with good stability and reliability.

Description

technical field

[0001] The invention relates to a glass, in particular to a high temperature and high pressure resistant sealing glass material and a preparation method thereof. Background technique

[0002] In the field of modern industry, agriculture and special industries, a large number of functional devices such as thermocouples, thermal resistances, heating devices and signal connectors are used to control and measure parameters such as temperature, pressure and electromagnetic. With the development, the requirements for packaging materials and sealing technology are getting higher and higher, especially in harsh environments such as high temperature, high pressure, oil and gas exploration and other fields. Traditional encapsulation methods such as using various epoxy resins, silicone rubber and different high-temperature adhesives for curing and sealing. Since these high-temperature adhesives are all organic materials, due to their own performance limitations, they ca...