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Single component organic silicon packaging glue cured by ultraviolet for high-power LED

A technology of ultraviolet rays and encapsulation adhesives, applied in adhesives, other chemical processes, chemical instruments and methods, etc., can solve the problems of epoxy resin curing speed, heat resistance, high temperature yellowing, light transmission stability, and heat dissipation that cannot meet performance indicators and other issues, to achieve the effect of improving light transmittance, convenient use, and simple packaging process

Inactive Publication Date: 2010-06-23
陈俊光
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  • Summary
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  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] At present, ordinary high-power LED encapsulants are mainly composed of transparent epoxy resins. Due to the curing speed, heat resistance, high-temperature yellowing, light transmission stability, and heat dissipation of epoxy resins, they cannot meet the current requirements. Some high-power LED packaging must have performance indicators, so there must be better materials to meet the packaging physical and chemical performance requirements

Method used

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  • Single component organic silicon packaging glue cured by ultraviolet for high-power LED
  • Single component organic silicon packaging glue cured by ultraviolet for high-power LED
  • Single component organic silicon packaging glue cured by ultraviolet for high-power LED

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Embodiment Construction

[0055] Synthesis of UV organosilicon encapsulating glue raw material of the present invention

[0056] Component A Synthesis of prepolymers containing acrylate-based polysiloxanes

[0057] Synthesis of A-1 V9

[0058] 1 Raw materials and solvents:

[0059] ①a.w-dihydropolydimethylsiloxane, viscosity (250℃) 2000mm 2 .s -1 Hydrogen content 0.0037% by mass, colorless and transparent, structural formula: V8

[0060] n=about 730 V8

[0061] ②HDDA 1, 6 hexanediol, purchased, purity over 98.5%

[0062] ③Inhibitor: Tris(3.5-di-tert-butyl-4-hydroxybenzyl) isocyanate

[0063] ④ Catalyst: Hexamethyldipyridine diplatinum iodide (solid)

[0064] ⑤ solvent, anhydrous benzene

[0065] 1. Synthesis reaction:

[0066]In the flask, install a stirring temperature medium, a reflux condenser and a dropping cup, and a nitrogen device. Dry first and then flush with nitrogen. Add 4g of HDDA, 800g of anhydrous benzene, 2g of polymerization inhibitor, stir and raise the temperature to 26°C...

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Abstract

The invention relates to a single component organic silicon packaging glue cured by ultraviolet for high-power LED and a preparation method thereof. The packaging glue is prepared by mixing a prepolymer component A containing acrylate polysiloxanes, a monomer component B containing acrylate polysiloxanes, a photosensitizer component C and a tackifier component D. The packaging glues obtained with different refractive indexes such as level 1.4, level 1.5 and the like are used for packaging multiple types of high-power LEDs or encapsulation of other optical purposes. By adopting ultraviolet curing, the invention enhances the packaging efficiency of the high-power LED product to a great extend without influencing the temperature tolerance, the discoloration and the light transmittance of the product.

Description

technical field [0001] The invention relates to an ultraviolet curing single-component organic silicon encapsulant for high-power LEDs and a preparation method thereof. technical background [0002] Ultra-brightness light-emitting diode (LIGHE EMITTING DIODE referred to as LED) is a kind of electroluminescent solid-state device. Compared with traditional incandescent lamps, fluorescent lamps, and high-intensity gas discharge lamps, LEDs have the advantages of very small operating current, no environmental pollution, simple structure, high brightness, small size, and long service life. Especially the successful development of white LED, high-power LED production has become a fact. In a short time, the main body of the fourth-generation light source will be formed. [0003] It can be seen from the structure of the LED illuminant that the LED chip is bonded to the matrix material and connected to the external electrodes through the lead. Then, the potting glue is used to con...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/07C09K3/10H01L33/56
Inventor 陈俊光
Owner 陈俊光
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