LED ceramic baseplate and preparation method thereof

A technology of ceramic substrate and organic solvent, applied in the field of high thermal conductivity, high reflection ceramic substrate and its preparation, can solve the problem of not considering optical requirements and the like, and achieve the effects of simple preparation method, prolonged service life and low roughness

Active Publication Date: 2013-10-09
SINOCERAM TECH (ZHENGZHOU) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, the current LED packaging substrates all use the traditional alumina ceramic substrates used for high-power thick film and hybrid integrated circuits, without considering the optical requirements

Method used

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  • LED ceramic baseplate and preparation method thereof
  • LED ceramic baseplate and preparation method thereof
  • LED ceramic baseplate and preparation method thereof

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preparation example Construction

[0046] A preparation method based on the aforementioned LED ceramic substrate described in the embodiment of the present invention includes the following steps:

[0047] Step S101. Accurately weigh and take out each component according to the weight percentage;

[0048] Step S102. Mix the weighed components uniformly and perform ball milling;

[0049] Step S103. Vacuum defoaming and stirring the ball-milled mixture in a constant temperature environment;

[0050] Step S104. The mixture after vacuum defoaming and stirring is sequentially subjected to coating molding, hot air drying, and punching to obtain a green sheet, and vacuum packaging, pressing and cooling the green sheet;

[0051] Step S105. The vacuum-encapsulated pressed and cooled green sheet is subjected to staling, low-temperature debinding, sintering and cooling.

[0052] Wherein, the said components that are weighed out are mixed uniformly and ball milled, which may specifically be: firstly, alumina, oxidation ad...

Embodiment 1

[0063] A LED ceramic substrate described in the embodiment of the present invention is made of the following components and their weight percentages: 60% aluminum oxide, 0.5% rare earth oxide, 30% organic solvent, 1.2% surfactant, and 3% adhesive , 2.5% plasticizer and 2.8% oxide additive; during preparation, according to the components and weight percentages and through the preparation method of the present invention, high heat dissipation, high surface finish, low roughness, and enhanced The reflectivity of light improves the light efficiency, reduces light decay, and prolongs the service life of LED lamps. Ceramic substrates for LED packaging.

Embodiment 2

[0065] An LED ceramic substrate described in the embodiment of the present invention is made of the following components and their weight percentages: 65% aluminum oxide, 0.4% rare earth oxide, 20% organic solvent, 0.8% surfactant, and 4.5% adhesive , 5.3% plasticizer and 4% oxide additive; during preparation, according to the composition and weight percentage and through the preparation method of the present invention, high heat dissipation, high surface finish, low roughness, and enhanced The reflectivity of light improves the light efficiency, reduces light decay, and prolongs the service life of LED lamps. Ceramic substrates for LED packaging.

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Abstract

The invention provides an LED ceramic baseplate and a preparation method thereof. The baseplate comprises the following components by weight percent: 60-70 percent of aluminium oxide, 0.2-0.5 percent of rare earth oxide, 10-30 percent of organic solvent, 0.2-1.2 percent of surface-active agent, 3.5-5.5 percent of adhesive, 2.5-7.2 percent of fluidizer and 2-5 percent of oxide additive. The preparation method comprises the following steps of: first, respectively and accurately weighing the components at respective weight percent, uniformly mixing and ball milling; next, performing vacuum defoamation and agitating; then, sequentially performing coating forming, hot-air drying, punching processing, vacuum encapsulation, pressing and cooling; finally, performing aging, low-temperature burnout, sintering and cooling. Due to the adoption of the method, the prepared ceramic baseplate is high in heat dissipation performance and surface finish, low in roughness, enhances light reflectivity, improves lighting effect, reduces light decay, and prolongs service life of an LED lamp.

Description

【Technical field】 [0001] The invention relates to the technical field of ceramic substrates, in particular to a ceramic substrate with high thermal conductivity and high reflection for LED single chip packaging or chip integrated packaging (COB) and a preparation method thereof. 【Background technique】 [0002] Existing LED products have high light attenuation, which causes their service life to be greatly reduced. The light decay of LED is related to its junction temperature. The so-called junction temperature is the temperature of the semiconductor PN junction. The higher the junction temperature, the earlier the light decay will appear, that is, the shorter the life. [0003] There are many reasons for the light decay of LED products. Only about 15% of the input power of existing high-power LEDs is converted into light, and the rest is converted into heat. If the heat cannot be effectively dissipated, the LED junction temperature will rise. The thermal resistance of the L...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/10C04B35/622
Inventor 段明新
Owner SINOCERAM TECH (ZHENGZHOU) CO LTD
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