Image sensor module and forming method thereof

An image sensor and image sensing technology, which is applied in radiation control devices and other directions, can solve the problems that the performance of image sensor modules needs to be improved, and achieve the effects of superior structural performance, reduced design difficulty, and improved packaging performance

Active Publication Date: 2014-07-30
CHINA WAFER LEVEL CSP
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Problems solved by technology

[0005] However, in the prior art, when an image sensor chip and a signal processing chip are formed on one

Method used

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  • Image sensor module and forming method thereof
  • Image sensor module and forming method thereof
  • Image sensor module and forming method thereof

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Embodiment Construction

[0055] It can be seen from the background art that the existing chip packaging including the image sensing unit and the signal processing unit is difficult, and the performance of the formed image sensor module needs to be improved.

[0056] After research, it is found that in the prior art, the image sensing unit and the signal processing unit are usually packaged on the same chip. Specifically, the arrangement and interaction between the two should be considered when forming the signal processing chip on the image sensing chip. Connecting is a relatively difficult technology, which will lead to an increase in the difficulty of the packaging process; at the same time, the cost of the image sensor chip is high. After the signal processing chip is set on the image sensor chip, in order to consider the relationship between the signal processing chip and The interconnection of the image sensor chip will inevitably increase the area of ​​the image sensor chip, resulting in a signif...

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Abstract

The invention discloses an image sensor module and a forming method of the module. The image sensor module comprises a PCB substrate, a metal layer, an image sensing chip, welding protrusions and a signal processing chip. The PCB substrate is provided with a front face and a back face opposite to the front face, a hole penetrating through the PCB substrate is formed in the PCB substrate, circuit distribution is arranged in the PCB substrate, the metal layer is arranged on the front face of the PCB substrate, the metal layer is electrically connected with the circuit distribution, the image sensing chip is inversely arranged above the front face of the PCB substrate, the image sensing chip is provided with an image induction area and a bonding pad surrounding the image induction area which is arranged above the hole, the bonding pad is electrically connected with the metal layer, the welding protrusions are arranged on the surface of the metal layer, the signal processing chip is arranged on the back face of the PCB substrate, and the signal processing chip is electrically connected with the circuit distribution. The image sensing chip and the signal processing chip are separately arranged, the packaging process difficulty and the packaging cost are reduced, and the packaging performance of the image sensor module is improved.

Description

technical field [0001] The invention relates to semiconductor packaging technology, in particular to an image sensor module and its forming method. Background technique [0002] An image sensor is a sensor that senses external light and converts it into an electrical signal. After the image sensor chip is manufactured, a series of packaging processes are performed on the image sensor chip to form a packaged image sensor for use in various electronic devices such as digital cameras and digital video cameras. [0003] The traditional image sensor packaging method is usually packaged by wire bonding (Wire Bonding). However, with the rapid development of integrated circuits, longer leads make the product size unable to meet the ideal requirements. Therefore, wafer-level packaging (WLP: Wafer Level Package) has gradually replaced wire bonding packaging as a more commonly used packaging method. Wafer-level packaging technology has the following advantages: the entire wafer can b...

Claims

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Application Information

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IPC IPC(8): H01L27/146
Inventor 王之奇喻琼王蔚
Owner CHINA WAFER LEVEL CSP
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