Image sensor module and forming method thereof

Abstract

The invention discloses an image sensor module and a forming method of the module. The image sensor module comprises a PCB substrate, a metal layer, an image sensing chip, welding protrusions and a signal processing chip. The PCB substrate is provided with a front face and a back face opposite to the front face, a hole penetrating through the PCB substrate is formed in the PCB substrate, circuit distribution is arranged in the PCB substrate, the metal layer is arranged on the front face of the PCB substrate, the metal layer is electrically connected with the circuit distribution, the image sensing chip is inversely arranged above the front face of the PCB substrate, the image sensing chip is provided with an image induction area and a bonding pad surrounding the image induction area which is arranged above the hole, the bonding pad is electrically connected with the metal layer, the welding protrusions are arranged on the surface of the metal layer, the signal processing chip is arranged on the back face of the PCB substrate, and the signal processing chip is electrically connected with the circuit distribution. The image sensing chip and the signal processing chip are separately arranged, the packaging process difficulty and the packaging cost are reduced, and the packaging performance of the image sensor module is improved.

Description

technical field [0001] The invention relates to semiconductor packaging technology, in particular to an image sensor module and its forming method. Background technique [0002] An image sensor is a sensor that senses external light and converts it into an electrical signal. After the image sensor chip is manufactured, a series of packaging processes are performed on the image sensor chip to form a packaged image sensor for use in various electronic devices such as digital cameras and digital video cameras. [0003] The traditional image sensor packaging method is usually packaged by wire bonding (Wire Bonding). However, with the rapid development of integrated circuits, longer leads make the product size unable to meet the ideal requirements. Therefore, wafer-level packaging (WLP: Wafer Level Package) has gradually replaced wire bonding packaging as a more commonly used packaging method. Wafer-level packaging technology has the following advantages: the entire wafer can b...

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Problems solved by technology

[0005] However, in the prior art, when an image sensor chip and a signal processing chip are formed on one chip, chip design is difficult and the performance of the formed image sensor module needs to be improved.

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