1052results about How to "Improve packaging effect" patented technology

The invention discloses a display panel, a display apparatus and a preparation method for the display panel. The display panel comprises a substrate, an organic light emitting device, a thin film packaging layer, and a metal layer, wherein the substrate comprises a display region and a non-display region; the organic light emitting device is arranged in the display region of the substrate; the thin film packaging layer covers the organic light emitting device; the metal layer is positioned in the non-display region of the substrate; grooves are formed in the metal layer; and the grooves are filled with an organic layer. By virtue of setting the metal layer in the non-display region of the substrate, forming the grooves in the metal layer and filling the grooves with the organic layer, bending stress resistance and cutting stress resistance of an edge region are improved, so that risk of cracks on the edge is relieved, and crack expansion can be effectively prevented.

An integrated circuit package and a method of manufacturing the package. A silicon chip is attached to the surface of a substrate or attached to the bottom surface of a cavity in the substrate so that the active surface of the chip is exposed. One or more build-up circuit structures are formed over the substrate. Each build-up circuit structure has at least one insulation layer, at least one patterned circuit layer and a plurality of via openings with conductive material therein so that bonding pads on the active surface of the chip connect electrically with the patterned circuit layer through the vias. To form a ball grid array package, solder balls may also be attached to the solder ball pads on the patterned circuit layer so that the bonding pads on the chip are electrically connected to an external circuit through the build-up circuit structure and the solder balls.

Provided is a packaging substrate with a heat-dissipating structure, including a core layer with a first surface and an opposite second surface having a first metal layer and a second metal layer respectively. Portions of the first metal layer are exposed from a second cavity penetrating the core layer and second metal layer. Portions of the second metal layer are exposed from a first cavity penetrating the core layer and first metal layer. Semiconductor chips each having an active surface with electrode pads thereon and an opposite inactive surface are received in the first and second cavities and attached to the second metal layer and the first metal layer respectively. Conductive vias disposed in build-up circuit structures electrically connect to the electrode pads of the semiconductor chips. A heat-dissipating through hole penetrating the core layer and build-up circuit structures connects the metal layers and contact pads.

To provide a lithium-nickel-cobalt-manganese composite oxide powder for a positive electrode of a lithium secondary battery, which has a large volume capacity density and high safety and is excellent in the charge and discharge cyclic durability.

A positive electrode active material powder for a lithium secondary battery characterized by comprising a first granular powder having a compression breaking strength of at least 50 MPa and a second granular powder having a compression breaking strength of less than 40 MPa, formed by agglomeration of many fine particles of a lithium composite oxide represented by the formula Li_pNi_xCo_yMn_zM_qO_2-aF_a (wherein M is a transition metal element other than Ni, Co and Mn, Al or an alkaline earth metal element, 0.9≦p≦1.1, 0.2≦x≦0.8, 0≦x≦0.4, 0≦z≦0.5, y+z>0, 0≦q≦0.05, 1.9≦2−a≦2.1, x+y+z+q=1, and 0≦a≦0.02) to have an average particle size D50 of from 3 to 15 μm, in a weight ratio of the first granular powder/the second granular powder being from 50/50 to 90/10.

To provide a lithium/nickel/cobalt/manganese-containing composite oxide powder which has a high weight capacity density, a high packing property, an excellent cycle property, an excellent discharge rate property and an excellent safety, and which has little content of free alkalis and is free from gelation at a time of producing a slurry.

A lithium/nickel/cobalt/manganese-containing composite oxide powder represented by the formula Li_pNi_xCo_yMn_zM_qO_2-aF_a (wherein M is at least one element selected from the group consisting of Al, Ge, Sn, alkaline earth metal elements and transition metal elements other than Co, Mn and Ni, 0.9≦p≦1.1, 0.2≦x≦0.5, 0.2≦y≦0.5, 0.1≦z≦0.4, 0≦q≦0.05, 1.9≦2-a≦2.1, p+x+y+z+q=2, and 0≦a≦0.02), characterized in that when the powder is classified into small particle size-classified particles with an average particle size of 2 μm≦D₅₀≦8 μm and large particle size-classified particles with an average particle size of 10 μm≦D₅₀≦25 μm, the ratio of (% by weight of the small particle size-classified particles)/(% by weight of the large particle size-classified particles) is from 15/85 to 40/60, the molar ratio (ps) of lithium to the total of nickel, cobalt, manganese and the M element contained in the small particle size-classified particles is smaller than the molar ratio (pl) of lithium to the total of nickel, cobalt, manganese and the M element contained in the large particle size-classified particles.

A semiconductor chip includes a semiconductor substrate having an opening portion and a frame portion defining a periphery of the opening portion. At least one electric element is provided on the frame portion, and has at least one electrode terminal. A first insulation film is formed on the frame portion so that the electrode terminal is partially exposed at the first insulation film to form a plurality of electrode pads.

A packing case for an image forming apparatus, comprising: a first packing member 5 for packing an image forming apparatus main body 1 including a reading section 11 having a scanner unit for reading a document image, an image forming section 14 having an image forming unit 12 for forming an image according to image data and a sheet feed unit 13 for feeding a sheet to the image forming unit 12, and a sheet storage space 16, formed to be open to outside between the reading section 11 and the image forming section 14, for storing a sheet transported from the image forming unit 12; and a second packing member 4 for packing a toner cartridge 2 containing toner to be supplied to the image forming unit 12 and capable of being inserted into and removed from the image forming apparatus main body 1, in which the second packing member 4 is inserted and fixed in the sheet storage space 16. This packing case enables a decrease in the overall size of the packing case and a reduction in the cost of the packing case.

The invention discloses an OLED package structure and a manufacture method thereof and a display device, and belongs to the field of display device package. The OLED package structure comprises a plurality of film layers covering an OLED device. The plurality of film layers comprise alternately-stacked inorganic layers and organic layers; and any two mutually-contacted film layers of the plurality of film layers are in clamp connection. The OLED package structure and the manufacture method thereof and the display device solve the problem of poor package effect of the OLED package structure; and the package effect of the OLED package structure is improved. The OLED package structure and the manufacture method thereof are used for package of the OLED device.

The invention discloses a soft tissue packing machine, and relates to the technical field of tissue packing machinery. The soft tissue packing machine comprises a path division conveying component, a material sorting conveying component, a membrane supporting and conveying component, a bag opening and strutting component, a negative pressure conveying component, a bag pushing component and a cutter seal component. The soft tissue packing machine disclosed by the invention has the advantages that the bag opening and strutting component, a membrane conveying mechanism and a membrane conveying mechanism are improved, according to the soft tissue packing machine, the bag opening size of packing bags can be regulated, the soft tissue packing machine is suitable for the package of products in any specifications, the soft tissue packing machine adopts integral operation, the efficiency is improved, the cost is reduced, and the packing quality can also be unified.

The present invention discloses an array substrate, a display panel and a display device. The array substrate comprises: a substrate and a pixel unit; a first electrode wiring and a second electrode wiring formed at one side of the substrate, wherein the first electrode wiring is configured to provide first power voltage signals to the anode layer of the pixel unit, and the second electrode wiringis configured to provide second power voltage signals to the cathode layer of the pixel unit; and a first metal wiring and a second metal wiring formed at a non-display area and enclosing a display area, wherein the first metal wiring and the first electrode wiring are electrically connected, and the second metal wiring and the second electrode wiring are electrically connected. The first metal wiring and the first electrode wiring are electrically connected, and the second metal wiring and the second electrode wiring are electrically connected to reduce the transmission wiring resistance andreduce the voltage drops of power supply signals on the transmission wirings. The individually arranged metal wirings are divided into the first metal wiring and the second metal wiring which are arranged in an insulation mode so as to reduce the stress on the first metal wiring and the second metal wiring.

The embodiment of the invention discloses a display panel manufacturing method, a display panel and a display device. The display panel manufacturing method comprises the steps of providing a substrate base plate; forming multiple light emitting units on the substrate base plate; forming a thin film packaging layer that covers the multiple light emitting units; forming a first film layer on the thin film packaging layer, wherein the distance between a projection, positioned on the substrate base plate, of a margin of a driver chip binding area on the display panel, which is adjacent to the light emitting units, and a projection, positioned on the substrate base plate, of a margin of the first film layer, which is adjacent to the driver chip binding area, is greater than or equal to 0 micron, or less than or equal to 100 microns; and positioning the projection, positioned on the substrate base plate, of the first film layer within a projection, positioned on the substrate base plate, of the thin film packaging layer; and to etching the thin film packaging layer by adopting the first film layer as a covering film so as to overlap the projection, positioned on the substrate base plate, of the margin of the first film layer generate and the projection, positioned on the substrate base plate, of the margin of the thin film packaging layer subjected to etching. According to the display panel manufacturing method, the display panel and the display device disclosed by the embodiment of the invention, the packaging effect of the thin film packaging layer in an organic light emitting display panel can be improved.

The invention relates to an OLED device and a method of the OLED device. The OLED device comprises a substrate, a light emitting element on the substrate and a packaging cover, the light emitting element comprises a first electrode layer, a second electrode layer and a light emitting layer between the first electrode layer and the second electrode layer, and an inorganic pixel limiting layer used for sealing the light emitting element between the first electrode layer and the second electrode layer is arranged around the light emitting element. The inorganic pixel limiting layer is closely attached to the first electrode layer and the second electrode layer. Through the arrangement, the light emitting layer is surrounded in internal inorganic layer closed space, the capacity of blocking moisture and oxygen can be improved, and therefore the packaging effect is improved, and the structure is simple.

The invention provides an organic light emitting diode device and a packaging method and device thereof. The packaging method comprises the steps that a first substrate is provided, wherein a closed cofferdam adhesive and a filling adhesive located in the filling area defined by the cofferdam adhesive are formed on the first substrate, and the filling adhesive is doped with magnetic particles; a substrate is provided, and the organic light emitting diode device is formed on the second substrate; a magnetic field moving module is provided; the first substrate and the second substrate are pressed, the magnetic field moving module is controlled to move in the designated direction on the outer side of the first substrate and/or the second substrate so as to drive the magnetic particles in the filling adhesive to move in the designated direction, the filling adhesive is forced to be dispersed all around in the filling area, air bubbles can be extruded from the inside of the filling adhesive, and the packaging effect of the organic light emitting diode device is improved.

A package substrate having embedded capacitor is provided. The package substrate includes a first core circuit board, at least one embedded capacitor, a second core circuit board and a dielectric layer. At least one metal layer is disposed on a surface of the first core circuit board and at least one first conductive through hole of the first core circuit board is connected to the metal layer. The embedded capacitor is embedded in the first core circuit board and connected to the metal layer. A wiring layer is disposed on a surface of the second core circuit board and at least one second conductive through hole of the second core circuit board is connected to the wiring layer. The dielectric layer is laminated between the first and the second core circuit boards.