Package structure and package method of organic light-emitting diode (OLED) device

Abstract

The invention provides a package structure and a package method of an organic light-emitting diode (OLED) device. The package structure of the OLED device comprises a substrate (1), an OLED device (2), a first blocking layer (3), a buffer layer (4) and a second blocking layer (5), wherein the OLED device (2) is arranged on the substrate (1), the first blocking layer (3) is formed on the OLED device (2), the buffer layer (4) is formed on the first blocking layer (3), the second blocking layer (5) is formed on the buffer layer (4), and the buffer layer (4) is doped with water absorption particles (41). By doping the water absorption particles into the buffer layer, the ability of preventing moisture of the package structure is enhanced, and thus, the service life of the OLED device can be effectively prolonged. According to the package method of the OLED device, moisture invasion can be effectively blocked, the package effect is improved, and the service life of the OLED is effectively prolonged. The method is simple and is high in operability.

Description

technical field [0001] The invention relates to the field of packaging technology, in particular to a packaging structure of an OLED device and a packaging method thereof. Background technique [0002] OLED is Organic Light-Emitting Diode (Organic Light-Emitting Diode), which has the characteristics of self-illumination, high brightness, wide viewing angle, high contrast, flexibility, and low energy consumption. Instead of traditional liquid crystal displays, it is widely used in mobile phone screens, computer monitors, full-color TVs, etc. Unlike traditional liquid crystal display technology, OLED display technology does not require a backlight, and uses very thin coatings of organic materials and glass substrates that emit light when an electric current passes through them. However, because organic materials are easy to react with water vapor or oxygen, as a display device based on organic materials, OLED displays have very high requirements for packaging. [0003] Most ...

AI Technical Summary

Problems solved by technology

However, the encapsulation structure of this kind of OLED device depends heavily on the quality of each film layer, especially the quality of the inorganic film layer, such as figure 2 As shown, the inevitable defects of the inorganic film formed at low temperature will form water vapor erosion channels, which will cause the performance of the packaging structure to deteriorate.

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