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65results about How to "Reduce the risk of stripping" patented technology

Display panel and display device

The embodiment of the invention provides a display panel and a display device. The display panel comprises a substrate base plate and a flexible packaging layer arranged on the substrate base plate, wherein the flexible packaging layer comprises a first inorganic layer; and a power signal line, a signal connection layer and a first electrode sequentially arranged on the substrate base plate, wherein the signal connection layer is connected with the power signal line and the first electrode. The display panel also comprises an inorganic contact layer arranged between the signal connection layerand the power signal line, wherein the signal connection layer comprises a plurality of via holes, and the first inorganic layer contacts the inorganic contact layer by the via holes. According to the display panel and the display device provided by the invention, through the arrangement of the inorganic contact layer and the via holes formed in the signal connection layer, the first inorganic layer used for packaging contacts the inorganic contact layer by the via holes, and thus the contact force between the first inorganic layer and the display panel is increased, the packaging effect is enhanced, and the risk that the first inorganic layer is peeled off during a flexible bending process is reduced.
Owner:WUHAN TIANMA MICRO ELECTRONICS CO LTD

Liquid crystal display panel and manufacturing method thereof

The invention provides a liquid crystal display panel and a manufacturing method thereof. The liquid crystal display panel comprises a first substrate, a baffle wall, an alignment film and frame glue,wherein the baffle wall, the alignment film and the frame glue are arranged on the first substrate, the baffle wall is in an annular shape, the alignment film is arranged at an inner side of the baffle wall, the frame glue is arranged at an outer side of the baffle film, the baffle film comprises at least two layers of sub baffle walls which are sequentially arranged from bottom to top, each subbaffle wall is in an annular shape, in two adjacent layers of baffle walls, the projection of an inner side wall of the sub baffle wall at an upper layer is arranged between an inner side wall and anouter side wall of the sub baffle wall at a lower layer, so that the inner side wall of the baffle wall is in a step shape, the climbing resistance of a solution for forming the alignment film at theinner side wall of the baffle wall is greatly improved during preparation of the alignment film at the inner side of the baffle wall by a solution film formation mode, the alignment film is preventedfrom being expanded out of the baffle plate and overlapped with the frame glue, and the stripping risk of the frame glue is reduced.
Owner:TCL CHINA STAR OPTOELECTRONICS TECH CO LTD

Heat preventing and insulating integrated thermal protection structure suitable for negative curvature shape

The invention discloses a heat preventing and insulating integrated thermal protection structure suitable for a negative curvature shape, and belongs to the technical field of thermal protection of hypersonic-speed near space aircrafts. The thermal protection structure includes a force bearing shell and a thermal protection layer; the thermal protection layer includes a heat insulating layer and aheat preventing layer, the inner wall of the heat preventing layer is provided with grid-like heat-preventing layer reinforcement ribs, the heat insulating layer is arranged in the grids of the heat-preventing layer reinforcement ribs, and the surface of the heat insulating layer is provided with a heat insulating layer covering skin; the heat preventing layer, the heat insulating layer coveringskin, and the heat-preventing layer reinforcing ribs are sewed together with the heat insulating layer through a sewing line in a prepreg state, and the whole is subjected to high-temperature curing to form the heat preventing and insulating integrated structure; and an adhesive layer is located between the force bearing shell and the thermal protection layer, and the adhesive layer is an adhesivewith high-temperature resistance and heat matching performance. The thermal protection structure provided by the invention adopts the heat preventing and insulating integrated thermal protection layer, and the thermal protection layer is bonded to the force bearing shell by using the high-temperature-resistant adhesive, so that interface separation at the negative curvature part of the thermal protection structure of an aircraft can be avoided.
Owner:THE GENERAL DESIGNING INST OF HUBEI SPACE TECH ACAD

Display panel and manufacturing method thereof and display device

The invention discloses a display panel and a manufacturing method thereof and a display device. The display panel comprises: a substrate; a flat layer which is arranged at one side of the substrate;a retaining wall which is positioned in a peripheral area, wherein the retaining wall is positioned on one side, deviating from the substrate, of the flat layer and is of an annular structure surrounding a display area; a packaging layer which covers the display area and at least part of the peripheral area; a touch barrier layer which is located on the side, deviating from the substrate, of the packaging layer; and a water blocking layer which is located in the peripheral area, wherein the water blocking layer is located between the flat layer and the touch barrier layer, the flat layer and the touch barrier layer extend to the side, away from the display area, of the retaining wall. The water blocking layer located between the flat layer and the touch barrier layer is arranged in the peripheral area, in the wet cleaning process before the touch barrier layer is formed, due to the fact that the water blocking layer covers the flat layer located in the peripheral area, the phenomenon that the flat layer absorbs water can be relieved, and the risk of stripping between the touch barrier layer and the flat layer is effectively reduced.
Owner:BOE TECH GRP CO LTD +1

Display panel cutting and trimming method, display panel and display device

The invention relates to the technical field of display, and particularly relates to a display panel cutting and trimming method, a display panel and a display device. The cutting and trimming method comprises the following steps that a flexible substrate comprises a first organic layer, an inorganic layer and a second organic layer which are arranged in a stacked mode, and the first organic layer is located on the side, away from the light emitting surface of the display panel, of the inorganic layer; a barrier layer is formed on at least one side, far away from the first organic layer, of the second organic layer, and the barrier layer is patterned by taking the cutting channel as a center; the flexible substrate is etched by taking the barrier layer as a mask pattern to at least expose the first organic layer so as to form a groove taking the cutting channel as the center on the flexible substrate; and laser cutting and trimming are performed on the cutting area along the cutting channel. The grooves can avoid the influence of residual heat in the laser cutting process on interfaces of the second organic layer and the inorganic layer, the problems of interface bonding force weakening, dislocation and warping separation of the second organic layer and the inorganic layer are solved, and then the risk of film layer stripping caused by multiple times of bending is reduced.
Owner:WUHAN TIANMA MICRO ELECTRONICS CO LTD

Battery cell module surface pretreatment device, battery cell module surface treatment method and battery pack assembly production line

The invention discloses a battery cell module surface pretreatment device, a battery cell module surface treatment method and a battery pack assembly production line. The battery cell module surface pretreatment device comprises a battery cell module supporting table; a battery cell module locking mechanism used for fixing a workpiece on the battery cell module supporting table; a paper removing mechanism which is positioned in the outer side of the end part of the battery cell module supporting table and can reciprocate along the extending direction of the end part of the battery cell modulesupporting table; a cleaning mechanism which comprises a cleaning device located outside the side face of the battery cell module supporting table, and the cleaning device at least can reciprocate inthe extending direction of the side face of the battery cell module supporting table. According to the scheme, the battery cell module supporting table is arranged for supporting the battery cell module, the locking mechanism is arranged for positioning and fixing the battery cell, the paper removing mechanism and the cleaning mechanism are combined, paper removing and cleaning operation of the battery cell module can be achieved in one step, the automation degree is high, the efficiency is improved, cleaning and paper removing do not interfere with each other, and the treatment quality is guaranteed.
Owner:SUZHOU JEE INTELLIGENT EQUIP CO LTD

Polaroid, liquid crystal display panel, liquid crystal display device and assembling method thereof

The invention provides a polaroid which comprises a polaroid body, at least one corner of the polaroid body is provided with a notch, when the polaroid is attached to a substrate of a liquid crystal display panel, the substrate exposes an area corresponding to the at least one notch, the notch is provided with an inner side edge and an outer side edge which are opposite to each other, and the inner side edge and the outer side edge have at least three intersection points. According to the polaroid, under the condition that it is guaranteed that the protective film of the polaroid is easy to tear, the notch in the polaroid is designed to be the non-communication area, compared with a crescent-shaped notch in the prior art, the notch is smaller, and the area exposed out of the substrate is reduced. After the liquid crystal display panel is attached to the backlight module, the gap between the liquid crystal display panel and the backlight module is reduced, so that the attaching area between the polaroid and the backlight module can be enlarged, the adhesive force between the polaroid and the backlight module is increased, the stripping risk is reduced, and the yield of the liquid crystal display device is improved. The invention further provides a liquid crystal display panel, a liquid crystal display device and an assembling method thereof.
Owner:WUHAN CHINA STAR OPTOELECTRONICS TECH CO LTD

Semiconductor packaging method and semiconductor packaging structure

The invention provides a semiconductor packaging method and a semiconductor packaging structure. The semiconductor packaging method comprises the steps that at least one to-be-packaged chip and an auxiliary member are mounted on a carrier plate, wherein the auxiliary member comprises auxiliary structures in one-to-one correspondence with the chips, the auxiliary structure comprises an auxiliary part arranged on the peripheral side of the chip, the chip comprises a first surface and a second surface opposite to the first surface, the first surface is provided with a plurality of welding pads, and the first surface of the chip faces the carrier plate, the auxiliary part comprises a third surface and a fourth surface opposite to the third surface, the third surface faces the carrier plate, and a gap exists between the third surface and the carrier plate; an encapsulation layer is formed, the encapsulation layer covers the carrier plate and encapsulates the at least one to-be-packaged chipand the auxiliary part, the second surface and the fourth surface are exposed out of the encapsulation layer, and the third surface is covered by the encapsulation layer; a heat dissipation layer isformed on one side of the first surface, wherein the heat dissipation layer covers the chip and the auxiliary structure; the material of the heat dissipation layer and the material of the auxiliary structure are both metal.
Owner:SIPLP MICROELECTRONICS CHONGQING CO LTD

Bipolar membrane based on pre-modified metal organic framework material and preparation method and application thereof

The invention discloses a bipolar membrane based on a pre-modified metal organic framework material and a preparation method thereof. A commercial anion exchange membrane is used as a substrate, the surface of the anion exchange membrane is coated with an adhesive, a metal organic framework material and sulfonated polyethersulfone are blended and coated on an adhesive layer, and the bipolar membrane is prepared through a solvent evaporation method. By introducing the pre-modified metal organic framework material, the problems that the nano material is easy to agglomerate, the doping amount istoo low, the nano material is easy to leak and the like are better solved, the structure of the membrane is improved, an effective channel is provided for migration of ions in the cation exchange membrane side, the ion migration rate can be increased, the succinic acid yield is increased. The bipolar membrane has the advantages of stable membrane performance, simple preparation process, high separation efficiency, high doping amount and the like, and solves the problem that a cathode membrane and an anode membrane in the bipolar membrane are easy to layer and peel. The bipolar membrane has a wide application prospect in the field of preparation of succinic acid from the bipolar membrane.
Owner:OCEAN UNIV OF CHINA

Preparation method of stable and high-efficiency silicon heterojunction solar cell

The invention discloses a preparation method of a stable and high-efficiency silicon heterojunction solar cell. The preparation method comprises the steps of depositing an intrinsic amorphous siliconthin film on the surface of an accumulation thin film, wherein the accumulation thin film comprises an accumulation thin film in a deposition chamber, the intrinsic amorphous silicon thin film deposited in the deposition chamber is an amorphous silicon thin film with high hydrogen content and high disorder degree, and the high hydrogen content refers to that the percentage content of hydrogen is 10%-25% relative to the number of silicon atoms of 5.22*10<22> by calculating the number of hydrogen atoms in unit volume; and the high disorder degree means that the microstructure factor R is 15-80%.The amorphous silicon thin film is deposited in the deposition chamber and on the surface of the tray, so that the internal stress of the accumulation thin film can be effectively reduced, the falling of the accumulation thin film in the deposition chamber is avoided, the stable output of the high-efficiency low-cost silicon heterojunction solar cell is facilitated, the accumulation thin film isquickly processed, and the stable high-efficiency silicon heterojunction solar cell is obtained.
Owner:ZHONGWEI NEW ENERGY CHENGDU CO LTD

Anti-stripping sealing film for lithium battery and preparation method thereof and aluminum-plastic composite film thereof

The invention relates to an anti-stripping sealing film for a lithium battery and a preparation method thereof and an aluminum-plastic composite film thereof, wherein the anti-stripping sealing film comprises a sealing outer layer and a sealing inner layer; an adhesive resin layer is arranged between the sealing outer layer and the sealing inner layer. The composite film is subjected to twice foaming and once horizontal stretching; the aluminum-plastic composite film comprises a molding outer layer, an aluminum foil layer and an inner sealing layer, wherein the aluminum foil layer is bonded with the molding outer layer through a first bonding layer, the aluminum foil layer is bonded with the inner sealing layer through a second bonding layer, and the inner sealing layer adopts the sealingfilm. By changing the structure of the traditional sealing film (inner film) and connecting the sealing outer layer on the sealing inner film by adhesive resin, after the aluminum-plastic composite film is used, the sealing outer layer is used as an intermediate layer of the whole aluminum-plastic composite film, so that the problem that the prior intermediate layer needs to be coated with adhesive on two sides so as to increase the number of adhesive layers in the whole plastic composite film is avoided, and the peeling risk is reduced by reducing the number of adhesive layers.
Owner:江阴长庚高科技材料有限公司

Magnetic induction device and manufacturing method therefor

The invention provides a magnetic induction device. The magnetic induction device comprises a substrate, a first metal layer and a first dielectric layer; a groove is formed in the first surface of the substrate; the first metal layer is arranged in the groove; the surface of the first metal layer is lower than the first surface; the surface of the first metal layer and the first surface form a first concave part; and the first dielectric layer is arranged on the first surface of the substrate and the first concave part is filled with the first dielectric layer. According to the magnetic induction device and the manufacturing method therefor provided by the embodiments, the surface of the first metal layer is lower than the surface of the substrate to form the first concave part; in addition, the first dielectric layer is arranged on the surface of the substrate and the first concave part is filled with the first dielectric layer, so that the thickness of the dielectric between the first metal layer and the surface metal layer is increased while the thickness of the dielectric in other regions is unchanged; and therefore, stray capacitance can be lowered, breakdown voltage can be improved, and risk of substrate warping and dielectric layer stripping also can be lowered.
Owner:成都线易科技有限责任公司 +1

Circuit board manufacturing method

The invention provides a circuit board manufacturing method comprising the following steps: placing electronic elements configured with many receive pads into a contain groove formed by jointing a substrate with a bonding layer; forming a dielectric layer so as to cover the receive pads, the electronic elements, the bonding layer and the substrate, and etching the dielectric layer so as to exposethe receive pad top surfaces; forming a composite material layer so as to cover the receive pads and the dielectric layer, wherein the composite material layer comprises a platable dielectric layer, aconductive polymer layer and an anti-plating layer arranged from bottom to top in order; forming a plurality of open holes in the composite material layer so as to expose partial the receive pads andpartial the dielectric layer; forming a metal layer connected with the conductive polymer layer on the open hole bottoms and partial the side wall formed by the platable dielectric layer and the conductive polymer layer; forming a line layer in the open holes, and removing the conductive polymer layer and the anti-plating layer, wherein the line layer top surface is flush with the platable dielectric layer. The method can increase the circuit board area utilization rate and wiring density, and can improve the fine line peeling problems.
Owner:UNIMICRON TECH CORP
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