TFT substrate and manufacturing method thereof
A manufacturing method and substrate technology, which are used in semiconductor/solid-state device manufacturing, optics, instruments, etc., can solve the problems of peeling off the protective layer, difficult to control parameters, poor display of liquid crystal panels, etc., and achieve a small tilt angle and reduce undercutting phenomenon. , show good effect
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Publication Date
- 2018-07-06
Smart Images

Figure 1 
Figure 2 
Figure 3
Abstract
Description
technical field
[0001] The invention relates to the field of display technology, in particular to a TFT substrate and a manufacturing method thereof. Background technique
[0002] With the development of display technology, liquid crystal displays (Liquid Crystal Display, LCD) and other flat display devices are widely used in mobile phones, televisions, personal Various consumer electronic products such as digital assistants, digital cameras, notebook computers, and desktop computers have become the mainstream of display devices.
[0003] Most of the liquid crystal displays currently on the market are backlight liquid crystal displays, which include a liquid crystal display panel and a backlight module. The working principle of the liquid crystal display panel is to pour liquid crystal molecules between the thin film transistor array substrate (ThinFilm Transistor Array Substrate, TFT Array Substrate) and the color filter substrate (ColorFilter Substrate, CF Substrate), and...
Examples
Embodiment Construction
[0031] In order to further illustrate the technical means adopted by the present invention and its effects, the following describes in detail in conjunction with preferred embodiments of the present invention and accompanying drawings.
[0032] The drawings in this application are only schematic diagrams. Unless otherwise specified, they do not mean that the actual thickness ratio, flatness, and shape of each film layer are the same as those in the drawings. There are some differences from the schematic diagram, for example, the shape of the hole and the appearance of the combined part of each film layer will be different from the schematic diagram, which can be understood and known by those skilled in the art. The description of the sequence of process steps and the structure of the film layer in this application only indicates the sequence and relative position of the steps and film layers directly related to the technical problems of this application, and does not mean that ...