The invention discloses a packaging structure and method of an
image sensor, and belongs to the technical field of
semiconductor packaging. The packaging structure comprises a sensor
wafer, a light-transmitting cover plate, a
retaining wall, a packaging layer, a rewiring layer, a
silicon through hole and a
solder ball. The encapsulating layer wraps the side wall of the light-transmitting cover plate, the side wall of the
retaining wall and the side wall of the
chip, the upper surface of the encapsulating layer is flush with or slightly lower than the upper surface of the light-transmitting cover plate, and a low-
moisture-absorption-rate material is adopted to prevent
water vapor from invading the cavity and enhance the
mechanical strength. The packaging method mainly comprises the following steps: manufacturing a
retaining wall on a cover plate
wafer; bonding with a sensor
wafer to form a cavity;
thinning is carried out;
cutting to form a prefabricated module; carrying out encapsulation treatment; manufacturing a TSV, an RDL and a
solder ball; and finally
cutting. By means of the innovative packaging structure and method, the advantages of low cost and high efficiency of wafer-level packaging are kept, meanwhile, the packaging reliability is remarkably improved, and the packaging structure can meet the requirements of high-end application such as vehicle gauge level application and the like.